P74FCT3377DP datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > logic> logic> P74FCT3377DP

P74FCT3377DP: DescriptionD Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24; Categorylogic logic; File Size148KB，4 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/

Download Datasheet Parametric Compare View All

P74FCT3377DP Overview

D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24

P74FCT3377DP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Pyramid Semiconductor Corporation
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
Other features	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND
series	FCT
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
length	31.9405 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	D FLIP-FLOP
MaximumI(ol)	0.048 A
Number of digits	8
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Prop。Delay @ Nom-Sup	4.4 ns
propagation delay (tpd)	4.4 ns
Certification status	Not Qualified
Maximum seat height	4.318 mm
Maximum supply voltage (Vsup)	3.5 V
Minimum supply voltage (Vsup)	3.1 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Trigger type	POSITIVE EDGE
width	7.62 mm

Preview

Download Datasheet

View All

P74FCT3377DP Related Products

	P74FCT3377DP	P54FCT3377DDM	P74FCT3377CD	P54FCT3377CDM	P74FCT3377CP	P74FCT3377CSO	P74FCT3377DSO	P74FCT3377DD
Description	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24	D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation
Parts packaging code	DIP	DIP	DIP	DIP	DIP	SOIC	SOIC	DIP
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	SOP, SOP24,.4	SOP, DIP24,.3	DIP, DIP24,.3
Contacts	24	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND	WITH HOLD MODE; MULTIPLE CENTER PIN VCC AND GND
series	FCT	FCT	FCT	FCT	FCT	FCT	FCT	FCT
JESD-30 code	R-PDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-PDIP-T24	R-PDSO-G24	R-PDSO-G24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	31.9405 mm	31.75 mm	31.75 mm	31.75 mm	31.9405 mm	15.4 mm	15.4 mm	31.75 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
MaximumI(ol)	0.048 A	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A
Number of digits	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	SOP24,.4	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	4.4 ns	5.2 ns	5.2 ns	5.5 ns	5.2 ns	5.2 ns	4.4 ns	4.4 ns
propagation delay (tpd)	4.4 ns	5.2 ns	5.2 ns	5.5 ns	5.2 ns	5.2 ns	4.4 ns	4.4 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.318 mm	5.08 mm	5.08 mm	5.08 mm	4.318 mm	2.65 mm	2.65 mm	5.08 mm
Maximum supply voltage (Vsup)	3.5 V	3.5 V	3.5 V	3.5 V	3.5 V	3.5 V	3.5 V	3.5 V
Minimum supply voltage (Vsup)	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.5 mm	7.5 mm	7.62 mm

Recommended Resources

AC voltage current

High dynamic, low distortion all-crystal triode three-stage differential power amplifier

Fully automatic AC voltage stabilizer principle circuit diagram

555 negative dual output circuit

Light control automatic switch lighting

An interesting phenomenon of 51 MCU IO port operation: I want to achieve synchronous output of P1.1 port following P1.4 port, both of which drive LEDs. P1.4 port uses [url=http://article.ednchina.com/word/178833.aspx]timer[/url] to flip regularly, and the...; maker Test/Measurement

The op amp output noise contains the switching frequency of DCDC, but the power supply is actually very clean. How to improve it?: [i=s]This post was last edited by samyang13 on 2020-10-11 15:08[/i]Hello everyone, I recently tested the output of the PA78 amplifier, which is only used for DC amplification, but found that the rippl...; samyang13 Analog electronics

I am completely helpless!: Hello everyone: I have recently done an experiment on sending and receiving text messages via GPRS. After receiving the text message, I parse the number and content, and then reply to the content requ...; mcmamman Embedded System

REMAP, Bootloader, Flashloader: 1. REMAP:When it comes to REMAP, we should first think of what MAP is. I am not good at English, so I started with a quote out of context. MAP is a map, and Memory Map is a memory map. However, the re...; sdjntl MCU

Wind power introduction: Wind power　　Wind energy is usually referred to as the kinetic energy of air flow. Wind power generation is the conversion of the kinetic energy of air flow into electrical energy. Strong winds contain...; beh Industrial Control Electronics

Getting Started with IAR_EW430: The usage post of IAR_EW430 is the information I found when I was studying....; lu331364648 TI Technology Forum

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components