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N74H20A

Description
NAND Gate, TTL, PDIP14
Categorylogic    logic   
File Size68KB,1 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

N74H20A Overview

NAND Gate, TTL, PDIP14

N74H20A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.02 A
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Maximum supply current (ICC)20 mA
Prop。Delay @ Nom-Sup10 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

N74H20A Related Products

N74H20A S54H20W S54H20W/883B N74H20NB S54H20F
Description NAND Gate, TTL, PDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, PDIP14 NAND Gate, TTL, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP14,.3 DFP, FL14,.3 DFP, FL14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T14 R-XDFP-F14 R-XDFP-F14 R-PDIP-T14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14
Maximum operating temperature 70 °C 125 °C 125 °C 70 °C 125 °C
Minimum operating temperature - -55 °C -55 °C - -55 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP DFP DFP DIP DIP
Encapsulate equivalent code DIP14,.3 FL14,.3 FL14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK FLATPACK IN-LINE IN-LINE
Schmitt trigger NO NO NO NO NO
surface mount NO YES YES NO NO
technology TTL TTL TTL TTL TTL
Temperature level COMMERCIAL MILITARY MILITARY COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
MaximumI(ol) 0.02 A 0.02 A 0.02 A - 0.02 A
Maximum supply current (ICC) 20 mA 20 mA 20 mA - 20 mA
Prop。Delay @ Nom-Sup 10 ns 10 ns 10 ns - 10 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
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