NAND Gate, TTL, CDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.02 A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Maximum supply current (ICC) | 20 mA |
| Prop。Delay @ Nom-Sup | 10 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| S54H20F | S54H20W | S54H20W/883B | N74H20NB | N74H20A | |
|---|---|---|---|---|---|
| Description | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, PDIP14 | NAND Gate, TTL, PDIP14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of terminals | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | DFP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| Schmitt trigger | NO | NO | NO | NO | NO |
| surface mount | NO | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | - | 0.02 A |
| Maximum supply current (ICC) | 20 mA | 20 mA | 20 mA | - | 20 mA |
| Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 10 ns | - | 10 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
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