S3A/B - S3M/B
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
·
·
·
·
·
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Plastic Material - UL Flammability
Classification 94V-0
B
Dim
A
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
SMC
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
A
C
B
C
D
Mechanical Data
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·
·
·
·
Case: Molded Plastic
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
Marking: Type Number
J
D
E
G
H
H
G
E
J
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
S3
A/AB
50
30
@ T
A
= 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@T
T
= 75°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance (Note 2)
Typical Thermal Resistance Junction to Terminal
(Note 1)
Operating and Storage Temperature Range
@ I
F
= 3.0A
@T
A
= 25°C
@ TA = 125 °C
Symbo
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
C
j
R
qJT
T
j,
T
STG
S3
B/BB
100
70
S3
D/DB
200
140
S3
G/GB
400
280
3.0
100
1.15
10
250
40
10
-65 to +150
S3
J/JB
600
420
S3
K/KB
800
560
S3
M/MB
1000
700
Unit
V
V
A
A
V
µA
pF
°C/W
°C
Notes:
1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
DS16005 Rev. G-2
1 of 2
S3A/B-S3M/B
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
3.0
I
AV
, AVERAGE FORWARD CURRENT (A)
Resistive or
Inductive Load
10
2.5
2.0
1.0
1.5
1.0
0.1
0.5
0
25
50
75
100
125
150
0.01
I
F
PULSE WIDTH = 300 mS
0
0.4
0.8
1.0
1.4
1.8
T
T
, TERMINAL TEMPERATURE (ºC)
Fig. 1 Forward Current Derating Curve
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
100
I
R
, INSTANTANEOUS REVERSE CURRENT (µA)
120
Single Half-Sine-Wave
JEDEC Method
1000
100
T
j
= 125°C
80
60
10
1.0
T
j
= 25°C
40
20
0
1
0.1
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
10
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Forward Surge Current Derating Curve
100
DS16005 Rev. G-2
2 of 2
S3A/B-S3M/B
FPGA/CPLD
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