PC28F320J3D75E datasheet, PDF - EEWORLD Datasheet

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PC28F320J3D75E: DescriptionFlash, 2MX16, 75ns, PBGA64; Categorystorage storage; File Size786KB，66 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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PC28F320J3D75E Overview

Flash, 2MX16, 75ns, PBGA64

PC28F320J3D75E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	BGA, BGA64,8X8,40
Reach Compliance Code	compliant
Maximum access time	75 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	S-PBGA-B64
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of departments/size	32
Number of terminals	64
word count	2097152 words
character code	2000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	SQUARE
Package form	GRID ARRAY
page size	4/8 words
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
ready/busy	YES
Department size	128K
Maximum standby current	0.00012 A
Maximum slew rate	0.08 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	NO
type	NOR TYPE

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Numonyx™ Embedded Flash Memory (J3 v D)

32, 64, 128, and 256 Mbit (Monolithic)

Datasheet

Product Features

Architecture

— Symmetrical 128-Kbyte blocks

— 256 Mbit (256 blocks)

— 128 Mbit (128 blocks)

— 64 Mbit (64 blocks)

— 32 Mbit (32 blocks)

Performance

— 75 ns Initial Access Speed (32,64,128

Mbit densities)

— 95 ns Initial Access Speed (256Mbit only)

— 25 ns 8-word and 4-word Asynchronous

page-mode reads

— 32-Byte Write buffer;

4 µs per Byte Effective programming time

System Voltage

— V

= 2.7 V to 3.6 V

— V

CCQ

= 2.7 V to 3.6 V

Packaging

— 56-Lead TSOP (32, 64, 128, 256 Mbit)

— 64-Ball Numonyx Easy BGA package (32,

64, 128 and 256 Mbit)

Security

— Enhanced security options for code

protection

— 128-bit Protection Register:

64-bits Unique device identifier bits

64-bits User-programmable OTP bits

— Absolute protection with V

PEN

= GND

— Individual block locking

— Block erase/program lockout during power

transitions

Software

— Program and erase suspend support

— Flash Data Integrator (FDI), Common Flash

Interface (CFI) Compatible

Quality and Reliability

— Operating temperature:

-40 °C to +85 °C

— 100K Minimum erase cycles per block

— 0.13 µm ETOX™ VIII Process technology

316577-06

December 2007

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx

products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Legal L ines and D isc laim er s

Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.

Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented

subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or

otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting the

Numonyx website at

http://www.numonyx.com.

Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

December 2007

316577-06

Numonyx™ Embedded Flash Memory (J3 v D, Monolithic)

Contents

1.0

Introduction

.............................................................................................................. 6

1.1

Nomenclature ..................................................................................................... 6

1.2

Acronyms........................................................................................................... 6

1.3

Conventions ....................................................................................................... 7

Functional Overview

.................................................................................................. 8

2.1

Block Diagram .................................................................................................. 10

2.2

Memory Map..................................................................................................... 11

Package Information

............................................................................................... 12

3.1

56-Lead TSOP Package, 32-, 64-, 128-, and 256-Mbit ............................................ 12

3.2

Easy BGA Package, 32-, 64-, 128-, and 256-Mbit .................................................. 13

Ballouts and Signal Descriptions..............................................................................

4.1

Easy BGA Ballout, 32-, 64-,128-, 256-Mbit ........................................................... 15

4.2

56-Lead TSOP Package Pinout, 32-, 64-,128-, 256-Mbit.......................................... 16

4.3

Signal Descriptions ............................................................................................ 16

Maximum Ratings and Operating Conditions............................................................

5.1

Absolute Maximum Ratings................................................................................. 18

5.2

Operating Conditions ......................................................................................... 18

5.3

Power Up/Down ................................................................................................ 18

5.3.1 Power-Up/Down Characteristics................................................................ 18

5.3.2 Power Supply Decoupling ........................................................................ 19

5.4

Reset............................................................................................................... 19

Electrical Characteristics

......................................................................................... 20

6.1

DC Current Specifications ................................................................................... 20

6.2

DC Voltage specifications.................................................................................... 21

6.3

Capacitance...................................................................................................... 22

AC Characteristics

................................................................................................... 23

7.1

Read Specifications............................................................................................ 23

7.2

Program, Erase, Block-Lock Specifications ............................................................ 29

7.3

Reset Specifications........................................................................................... 29

7.4

AC Test Conditions ............................................................................................ 30

Bus Interface...........................................................................................................

8.1

Bus Reads ........................................................................................................ 32

8.1.1 Asynchronous Page Mode Read ................................................................ 32

8.1.1.1 Enhanced Configuration Register................................................. 32

8.1.2 Output Disable ....................................................................................... 33

8.2

Bus Writes........................................................................................................ 33

8.3

Standby ........................................................................................................... 34

8.3.1 Reset/Power-Down ................................................................................. 34

8.4

Device Commands............................................................................................. 34

Flash Operations

..................................................................................................... 36

9.1

Status Register ................................................................................................. 36

9.1.1 Clearing the Status Register .................................................................... 37

9.2

Read Operations ............................................................................................... 37

9.2.1 Read Array ............................................................................................ 37

9.2.2 Read Status Register .............................................................................. 38

9.2.3 Read Device Information ......................................................................... 38

9.2.4 CFI Query ............................................................................................. 38

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

December 2007

316577-06

Datasheet

Numonyx™ Embedded Flash Memory (J3 v D, Monolithic)

9.3

9.4

9.5

9.6

9.7

Programming Operations ....................................................................................38

9.3.1 Single-Word/Byte Programming................................................................39

9.3.2 Buffered Programming ............................................................................39

Block Erase Operations .......................................................................................40

Suspend and Resume .........................................................................................41

Status Signal ....................................................................................................42

Security and Protection.......................................................................................43

9.7.1 Normal Block Locking ..............................................................................43

9.7.2 Configurable Block Locking.......................................................................44

9.7.3 OTP Protection Registers..........................................................................44

9.7.4 Reading the OTP Protection Register..........................................................44

9.7.5 Programming the OTP Protection Register ..................................................44

9.7.6 Locking the OTP Protection Register ..........................................................45

9.7.7 VPP/ VPEN Protection ..............................................................................46

10.0 ID Codes

..................................................................................................................47

11.0 Device Command Codes

...........................................................................................48

12.0 Flow Charts..............................................................................................................49

13.0 Common Flash Interface

..........................................................................................58

13.1 Query Structure Output ......................................................................................58

13.2 Query Structure Overview...................................................................................59

13.3 Block Status Register .........................................................................................60

13.4 CFI Query Identification String ............................................................................60

13.5 System Interface Information ..............................................................................61

13.6 Device Geometry Definition .................................................................................61

13.7 Primary-Vendor Specific Extended Query Table ......................................................62

Additional Information.............................................................................................65

Ordering Information

...............................................................................................66

Datasheet

December 2007

316577-06

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