EEWORLDEEWORLDEEWORLD

Part Number

Search

CDR31BP621AFUR

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CategoryPassive components    capacitor   
File Size1MB,10 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Related ProductsFound20parts with similar functions to CDR31BP621AFUR
Download Datasheet Parametric View All

CDR31BP621AFUR Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP

CDR31BP621AFUR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instruction, 0805
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.00062 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.3 mm
JESD-609 codee0
length2 mm
Manufacturer's serial numberCDR31
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 7 INCH
positive tolerance1%
Rated (DC) voltage (URdc)50 V
GuidelineMIL-PRF-55681
seriesC(SIZE)N
size code0805
surface mountYES
Temperature characteristic codeBP
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn70Pb30) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width1.25 mm
Base Number Matches1
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
BW
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note:
For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
Z
M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated
(SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin)
Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
Z – Base metallization -
barrier metal-tinned (tin/lead
alloy, with a min. of 4% lead)
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M
L
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
L — 70Sn/30Pb Plated (Military codes Z,W,U )
C— 100% Tin Plated (Military code Y)
H – Sn60 Coated (Military code S)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
R — 0.01
S — 0.001
M — 1.0
P — 0.1
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
*
Part Number Example: C0805P101K1GML
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001

CDR31BP621AFUR Similar Products

Part Number Manufacturer Description
C0805N621F5GMC KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFMM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFYS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFNR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFNS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFSM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFNM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFWM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFSR KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFYM KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFZM KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
C0805N621F5GSC KEMET(基美) Multilayer Ceramic Capacitors MLCC - SMD/SMT 620.PF 50.0V
CDR31BP621AFZS KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFSS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFWR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFWS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFSP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFMS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFYR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
CDR31BP621AFZR KEMET(基美) Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00062uF, Surface Mount, 0805, CHIP
ucosii system
I have been studying embedded systems recently. I may not have read the materials in detail. I also combined them with some small programs to study them. I have the following doubts. 1. The semaphore ...
大家都是好朋友 stm32/stm8
Application of new magnetic core structure in electronic transformer
1 搭接式卷绕磁芯搭接式卷绕磁芯最早用于非晶合金配电变压器。它既有卷绕磁芯优点,激磁电流小,空载损耗低,又可以打开装卸线圈,消除一般卷绕磁芯的缺点,不需要用专用绕线机绕制线圈,生产效率提高,线圈出现问题时也便于更换和维修。现有3%取向硅钢的厚度已减薄到0.23mm和0.27mm,用它们制造搭接式卷绕磁芯比非晶合金更容易。因此,搭接式卷绕磁芯有可能用于500VA 以上的硅钢电源变压器,尤其是大容量整...
zbz0529 Power technology
Image Recognition
Use and procedures of image recognition module (SPCE061A)...
jiangwen200808 MCU
51 MCU pwm square wave output, please correct it
This is a 1Khz pwm square wave, can it be changed to 40khz? How to change it? Thanks Search [align=left]Copy[/align]...
automomaek 51mcu
High voltage capacitor problem
High voltage -980V, the nominal value of the high voltage capacitor used is "103 1000V". Although the withstand voltage value is greater than the actual usage value, have you considered leaving a larg...
linjingui Analog electronics
Tps56221 power-on instantaneous current spike problem
When TPS56221 is powered on, the current peak reaches 20A, 5us, and then the power output is normal. Where is the problem?...
robotbros Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2450  1489  1412  2061  1140  50  30  29  42  23 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号