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HYM581000P-10

Description
Fast Page DRAM Module, 1MX8, 100ns, CMOS
Categorystorage    storage   
File Size680KB,10 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HYM581000P-10 Overview

Fast Page DRAM Module, 1MX8, 100ns, CMOS

HYM581000P-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
package instruction, SIP30,.2
Reach Compliance Codecompliant
Maximum access time100 ns
I/O typeCOMMON
JESD-609 codee0
memory density8388608 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width8
Number of terminals30
word count1048576 words
character code1000000
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
Encapsulate equivalent codeSIP30,.2
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height16.51 mm
Maximum standby current0.008 A
Maximum slew rate0.44 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal pitch2.54 mm
Terminal locationSINGLE

HYM581000P-10 Related Products

HYM581000P-10 HYM581000P-70 HYM581000P-80 HYM581000P-60
Description Fast Page DRAM Module, 1MX8, 100ns, CMOS Fast Page DRAM Module, 1MX8, 70ns, CMOS Fast Page DRAM Module, 1MX8, 80ns, CMOS Fast Page DRAM Module, 1MX8, 60ns, CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SK Hynix SK Hynix SK Hynix SK Hynix
package instruction , SIP30,.2 , SIP30,.2 , SIP30,.2 , SIP30,.2
Reach Compliance Code compliant compliant compliant compli
Maximum access time 100 ns 70 ns 80 ns 60 ns
I/O type COMMON COMMON COMMON COMMON
JESD-609 code e0 e0 e0 e0
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bi
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 8 8 8 8
Number of terminals 30 30 30 30
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Encapsulate equivalent code SIP30,.2 SIP30,.2 SIP30,.2 SIP30,.2
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512
Maximum seat height 16.51 mm 16.51 mm 16.51 mm 16.51 mm
Maximum standby current 0.008 A 0.008 A 0.008 A 0.008 A
Maximum slew rate 0.44 mA 0.6 mA 0.52 mA 0.68 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE
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