HYM581000P-70 datasheet, PDF - EEWORLD Datasheet

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HYM581000P-70: DescriptionFast Page DRAM Module, 1MX8, 70ns, CMOS; Categorystorage storage; File Size680KB，10 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HYM581000P-70 Overview

Fast Page DRAM Module, 1MX8, 70ns, CMOS

HYM581000P-70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
package instruction	, SIP30,.2
Reach Compliance Code	compliant
Maximum access time	70 ns
I/O type	COMMON
JESD-609 code	e0
memory density	8388608 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	8
Number of terminals	30
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
Encapsulate equivalent code	SIP30,.2
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	16.51 mm
Maximum standby current	0.008 A
Maximum slew rate	0.6 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm
Terminal location	SINGLE

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HYM581000P-70 Related Products

	HYM581000P-70	HYM581000P-10	HYM581000P-80	HYM581000P-60
Description	Fast Page DRAM Module, 1MX8, 70ns, CMOS	Fast Page DRAM Module, 1MX8, 100ns, CMOS	Fast Page DRAM Module, 1MX8, 80ns, CMOS	Fast Page DRAM Module, 1MX8, 60ns, CMOS
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix
package instruction	, SIP30,.2	, SIP30,.2	, SIP30,.2	, SIP30,.2
Reach Compliance Code	compliant	compliant	compliant	compli
Maximum access time	70 ns	100 ns	80 ns	60 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-609 code	e0	e0	e0	e0
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bi
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	8	8	8	8
Number of terminals	30	30	30	30
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	SIP30,.2	SIP30,.2	SIP30,.2	SIP30,.2
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512
Maximum seat height	16.51 mm	16.51 mm	16.51 mm	16.51 mm
Maximum standby current	0.008 A	0.008 A	0.008 A	0.008 A
Maximum slew rate	0.6 mA	0.44 mA	0.52 mA	0.68 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE

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