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2661A

Description
IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size659KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

2661A Overview

IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller

2661A Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknow
Address bus width2
boundary scanNO
letter of agreementASYNC, BIT; SYNC, BYTE; BISYNC
Maximum data transfer rate0.125 MBps
External data bus width8
JESD-30 codeR-CDIP-T28
low power modeNO
Number of serial I/Os1
Number of terminals28
Maximum operating temperature110 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.84 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1

2661A Related Products

2661A 2661C 2661B
Description IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller
Parts packaging code DIP DIP DIP
package instruction DIP, DIP, DIP,
Contacts 28 28 28
Reach Compliance Code unknow unknow unknown
Address bus width 2 2 2
boundary scan NO NO NO
letter of agreement ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC
Maximum data transfer rate 0.125 MBps 0.125 MBps 0.125 MBps
External data bus width 8 8 8
JESD-30 code R-CDIP-T28 R-CDIP-T28 R-CDIP-T28
low power mode NO NO NO
Number of serial I/Os 1 1 1
Number of terminals 28 28 28
Maximum operating temperature 110 °C 110 °C 110 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 5.84 mm 5.84 mm 5.84 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
width 15.24 mm 15.24 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1 -
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