2661C datasheet, PDF - EEWORLD Datasheet

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2661C: DescriptionIC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size659KB，20 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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2661C Overview

IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller

2661C Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknow
Address bus width	2
boundary scan	NO
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC
Maximum data transfer rate	0.125 MBps
External data bus width	8
JESD-30 code	R-CDIP-T28
low power mode	NO
Number of serial I/Os	1
Number of terminals	28
Maximum operating temperature	110 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.84 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches	1

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2661C Related Products

	2661C	2661A	2661B
Description	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller	IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, CERAMIC, DIP-28, Serial IO/Communication Controller
Parts packaging code	DIP	DIP	DIP
package instruction	DIP,	DIP,	DIP,
Contacts	28	28	28
Reach Compliance Code	unknow	unknow	unknown
Address bus width	2	2	2
boundary scan	NO	NO	NO
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC	ASYNC, BIT; SYNC, BYTE; BISYNC
Maximum data transfer rate	0.125 MBps	0.125 MBps	0.125 MBps
External data bus width	8	8	8
JESD-30 code	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28
low power mode	NO	NO	NO
Number of serial I/Os	1	1	1
Number of terminals	28	28	28
Maximum operating temperature	110 °C	110 °C	110 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.84 mm	5.84 mm	5.84 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches	1	1	-

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