UPD30111S1-66-3C datasheet, PDF

UPD30111S1-66-3C: DescriptionRISC Microprocessor, 64-Bit, 66MHz, MOS, PBGA224, 16 X 16 MM, FINE PITCH, BGA-224; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，80 Pages; ManufacturerNEC Electronics

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UPD30111S1-66-3C Overview

RISC Microprocessor, 64-Bit, 66MHz, MOS, PBGA224, 16 X 16 MM, FINE PITCH, BGA-224

Parameter Name	Attribute value
Maker	NEC Electronics
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	224
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	26
bit size	64
boundary scan	NO
maximum clock frequency	66.67 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PBGA-B224
length	16 mm
low power mode	YES
Number of terminals	224
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.46 mm
speed	66 MHz
Maximum supply voltage	2.7 V
Minimum supply voltage	2.3 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	MOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	16 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

	UPD30111S1-66-3C	UPD30111S1-80-3C
Description	RISC Microprocessor, 64-Bit, 66MHz, MOS, PBGA224, 16 X 16 MM, FINE PITCH, BGA-224	RISC Microprocessor, 64-Bit, 80MHz, MOS, PBGA224, 16 X 16 MM, FINE PITCH, BGA-224
Maker	NEC Electronics	NEC Electronics
Parts packaging code	BGA	BGA
package instruction	LFBGA,	LFBGA,
Contacts	224	224
Reach Compliance Code	unknown	compliant
ECCN code	3A001.A.3	3A001.A.3
Address bus width	26	26
bit size	64	64
boundary scan	NO	NO
maximum clock frequency	66.67 MHz	80 MHz
External data bus width	32	32
Format	FIXED POINT	FIXED POINT
Integrated cache	NO	NO
JESD-30 code	S-PBGA-B224	S-PBGA-B224
length	16 mm	16 mm
low power mode	YES	YES
Number of terminals	224	224
Maximum operating temperature	70 °C	70 °C
Minimum operating temperature	-10 °C	-10 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.46 mm	1.46 mm
speed	66 MHz	80 MHz
Maximum supply voltage	2.7 V	2.7 V
Minimum supply voltage	2.3 V	2.3 V
Nominal supply voltage	2.5 V	2.5 V
surface mount	YES	YES
technology	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
width	16 mm	16 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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