25AA256/25LC256
256K SPI Bus Serial EEPROM
Device Selection Table
Part Number
25LC256
25AA256
V
CC
Range
2.5-5.5V
1.8-5.5V
Page Size
64 Byte
64 Byte
Temp. Ranges
I, E
I, E
Packages
P, SN, SM, ST, MF
P, SN, SM, ST, MF
Features:
• Max. Clock 10 MHz
• Low-Power CMOS Technology:
- Max. Write Current: 5 mA at 5.5V, 10 MHz
- Read Current: 6 mA at 5.5V, 10 MHz
- Standby Current: 1
A
at 5.5V
• 32,768 x 8-bit Organization
• 64-Byte Page
• Self-Timed Erase and Write Cycles (5 ms max.)
• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• Sequential Read
• High Reliability:
- Endurance: 1,000,000 erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40°C to +125°C
• Pb-Free and RoHS Compliant
Description:
The Microchip Technology Inc. 25AA256/25LC256
(25XX256*) are 256 Kbit Serial Electrically Erasable
PROMs. The memory is accessed via a simple Serial
Peripheral Interface (SPI) compatible serial bus. The
bus signals required are a clock input (SCK) plus
separate data in (SI) and data out (SO) lines. Access to
the device is controlled through a Chip Select (CS)
input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
The 25XX256 is available in standard packages includ-
ing 8-lead PDIP and SOIC, and advanced packaging
including 8-lead DFN and 8-lead TSSOP.
Package Types (not to scale)
DFN
(MF)
CS 1
SO 2
WP 3
V
SS
4
8
7
6
5
V
CC
HOLD
SCK
SI
CS
SO
WP
V
SS
PDIP/SOIC
(P, SN, SM)
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
Pin Function Table
Name
CS
SO
WP
V
SS
SI
SCK
HOLD
V
CC
Function
Chip Select Input
Serial Data Output
Write-Protect
Ground
Serial Data Input
Serial Clock Input
Hold Input
Supply Voltage
CS
SO
WP
V
SS
1
2
3
4
HOLD
V
CC
CS
SO
1
2
3
4
Rotated TSSOP
(ST)
8
7
6
5
SCK
SI
V
SS
WP
TSSOP
(ST)
8
7
6
5
V
CC
HOLD
SCK
SI
* 25XX256 is used in this document as a generic part number
for the 25AA256/25LC256 devices.
2003-2013 Microchip Technology Inc.
DS21822G-page 1
25AA256/25LC256
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.6V to V
CC
+1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
†
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
0.7 V
CC
-0.3
-0.3
—
—
V
CC
-0.5
—
—
—
Typ.
(2)
—
—
—
—
—
—
—
—
—
Max.
V
CC
+1
0.3 V
CC
0.2 V
CC
0.4
0.2
—
±1
±1
7
Units
V
V
V
V
V
V
A
A
pF
V
CC
2.5V
V
CC
< 2.5V
I
OL
= 2.1 mA, V
CC
= 4.5V
I
OL
= 1.0 mA, V
CC
= 2.5V
I
OH
= -400
A
CS = V
CC
, V
IN
= V
SS OR
V
CC
CS = V
CC
, V
OUT
= V
SS OR
V
CC
T
A
= 25°C, F
CLK
= 1.0 MHz,
V
CC
= 5.0V
(Note
1)
V
CC
= 5.5V; F
CLK
= 10.0 MHz;
SO = Open
V
CC
= 2.5V; F
CLK
= 5.0 MHz;
SO = Open
V
CC
= 5.5V
V
CC
= 2.5V
CS = V
CC
= 5.5V, Inputs tied to V
CC
or V
SS
, 125°C
CS = V
CC
= 5.5V, Inputs tied to V
CC
or V
SS
, 85°C
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
DC CHARACTERISTICS
Param.
No.
D001
D002
D003
D004
D005
D006
D007
D008
D009
Sym.
V
IH
V
IL
V
IL
V
OL
V
OL
V
OH
I
LI
I
LO
C
INT
Characteristic
High-level input
voltage
Low-level input
voltage
Low-level output
voltage
High-level output
voltage
Input leakage current
Output leakage
current
Internal Capacitance
(all inputs and
outputs)
D010
I
CC
Read
Operating Current
—
—
—
—
—
Standby Current
—
2.5
0.5
0.6
0.15
0.1
6
2.5
5
3
5
1
mA
mA
mA
mA
A
A
D011
D012
I
CC
Write
I
CCS
Note 1:
2:
This parameter is periodically sampled and not 100% tested.
Typical measurements taken at room temperature (25°C).
DS21822G-page 2
2003-2013 Microchip Technology Inc.
25AA256/25LC256
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
—
—
—
50
100
150
100
200
250
50
10
20
30
20
40
50
—
—
50
100
150
50
100
150
50
50
—
—
—
0
—
—
—
20
40
80
20
40
80
Max.
10
5
3
—
—
—
—
—
—
—
—
—
—
—
—
—
100
100
—
—
—
—
—
—
—
—
50
100
160
—
40
80
160
—
—
—
—
—
—
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
—
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
(Note
1)
(Note
1)
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
—
—
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
(Note
1)
4.5V
Vcc
5.5V
(Note
1)
2.5V
Vcc
4.5V
(Note
1)
1.8V
Vcc
2.5V
(Note
1)
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
AC CHARACTERISTICS
Param.
Sym.
No.
1
F
CLK
Characteristic
Clock Frequency
2
T
CSS
CS Setup Time
3
T
CSH
CS Hold Time
4
5
T
CSD
Tsu
CS Disable Time
Data Setup Time
6
T
HD
Data Hold Time
7
8
9
T
R
T
F
T
HI
CLK Rise Time
CLK Fall Time
Clock High Time
10
T
LO
Clock Low Time
11
12
13
T
CLD
T
CLE
T
V
Clock Delay Time
Clock Enable Time
Output Valid from Clock
Low
Output Hold Time
Output Disable Time
14
15
T
HO
T
DIS
16
T
HS
HOLD Setup Time
17
T
HH
HOLD Hold Time
Note 1:
This parameter is periodically sampled and not 100% tested.
2:
T
WC
begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
3:
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
2003-2013 Microchip Technology Inc.
DS21822G-page 3
25AA256/25LC256
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
30
60
160
30
60
160
—
1M
Max.
—
—
—
—
—
—
5
—
Units
ns
ns
ns
ns
ns
ns
ms
V
CC
= 1.8V to 5.5V
V
CC
= 1.8V to 5.5V
Test Conditions
4.5V
Vcc
5.5V
(Note
1)
2.5V
Vcc
4.5V
(Note
1)
1.8V
Vcc
2.5V
(Note
1)
4.5V
Vcc
5.5V
2.5V
Vcc
4.5V
1.8V
Vcc
2.5V
(Note
2)
AC CHARACTERISTICS
Param.
Sym.
No.
18
T
HZ
Characteristic
HOLD Low to Output
High-Z
HOLD High to Output
Valid
Internal Write Cycle
Time
Endurance
19
T
HV
20
21
T
WC
—
E/W 25°C, V
CC
= 5.5V
(Note
3)
Cycles
Note 1:
This parameter is periodically sampled and not 100% tested.
2:
T
WC
begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
3:
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
TABLE 1-3:
AC Waveform:
V
LO
= 0.2V
AC TEST CONDITIONS
—
(Note
1)
(Note
2)
—
0.5 V
CC
0.5 V
CC
V
HI
= V
CC
– 0.2V
V
HI
= 4.0V
C
L
= 50 pF
Timing Measurement Reference Level
Input
Output
Note 1:
For V
CC
4.0V
2:
For V
CC
> 4.0V
DS21822G-page 4
2003-2013 Microchip Technology Inc.
Embedded System
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