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XCV812E-6BGG560I

Description
Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, CMOS, PBGA560, PLASTIC, BGA-560
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,118 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Environmental Compliance  
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XCV812E-6BGG560I Overview

Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, CMOS, PBGA560, PLASTIC, BGA-560

XCV812E-6BGG560I Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerXILINX
Parts packaging codeBGA
package instructionLBGA,
Contacts560
Reach Compliance Codecompliant
ECCN code3A001.A.7.A
maximum clock frequency357 MHz
Combined latency of CLB-Max0.47 ns
JESD-30 codeS-PBGA-B560
JESD-609 codee1
length42.5 mm
Humidity sensitivity level3
Configurable number of logic blocks4704
Equivalent number of gates254016
Number of terminals560
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4704 CLBS, 254016 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.89 V
Minimum supply voltage1.71 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width42.5 mm
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
0
R
Virtex™-E 1.8 V Extended Memory
Field Programmable Gate Arrays
0
0
DS025-1 (v3.0) March 21, 2014
Production Product Specification
Features
Fast, Extended Block RAM, 1.8 V FPGA Family
- 560 Kb and 1,120 Kb embedded block RAM
- 130 MHz internal performance (four LUT levels)
- PCI compliant 3.3 V, 32/64-bit, 33/66-MHz
Sophisticated SelectRAM+™ Memory Hierarchy
- 294 Kb of internal configurable distributed RAM
- Up to 1,120 Kb of synchronous internal block RAM
- True Dual-Port block RAM
- Memory bandwidth up to 2.24 Tb/s (equivalent
bandwidth of over 100 RAMBUS channels)
- Designed for high-performance Interfaces to
external memories
·
200 MHz ZBT* SRAMs
·
200 Mb/s DDR SDRAMs
Highly Flexible SelectIO+™ Technology
- Supports 20 high-performance interface standards
- Up to 556 singled-ended I/Os or up to 201
differential I/O pairs for an aggregate bandwidth of
>100 Gb/s
Complete Industry-Standard Differential Signalling
Support
- LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
- Al I/O signals can be input, output, or bi-directional
* ZBT is a trademark of Integrated Device Technology, Inc.
LVPECL and LVDS clock inputs for 300+ MHz
clocks
Proprietary High-Performance SelectLink™
Technology
- 80 Gb/s chip-to-chip communication link
- Support for Double Data Rate (DDR) interface
- Web-based HDL generation methodology
Eight Fully Digital Delay-Locked Loops (DLLs)
IEEE 1149.1 boundary-scan logic
Supported by Xilinx Foundation Series™ and Alliance
Series™ Development Systems
- Internet Team Design (Xilinx iTD™) tool ideal for
million-plus gate density designs
- Wide selection of PC or workstation platforms
SRAM-based In-System Configuration
- Unlimited re-programmability
Advanced Packaging Options
- 1.0 mm FG676 and FG900
- 1.27 mm BG560
0.18
μm
6-layer Metal Process with Copper
Interconnect
100% Factory Tested
-
Introduction
The Virtex™-E Extended Memory (Virtex-EM) family of
FPGAs is an extension of the highly successful Virtex-E
family architecture. The Virtex-EM family (devices shown in
Table 1)
includes all of the features of Virtex-E, plus addi-
tional block RAM, useful for applications such as network
switches and high-performance video graphic systems.
Xilinx developed the Virtex-EM product family to enable
customers to design systems requiring high memory band-
width, such as 160 Gb/s network switches. Unlike traditional
ASIC devices, this family also supports fast time-to-market
delivery, because the development engineering is already
completed. Just complete the design and program the
device. There is no NRE, no silicon production cycles, and no
additional delays for design re-work. In addition, designers
can update the design over a network at any time, providing
product upgrades or updates to customers even sooner.
The Virtex-EM family is the result of more than fifteen years
of FPGA design experience. Xilinx has a history of support-
ing customer applications by providing the highest level of
logic, RAM, and features available in the industry. The Vir-
tex-EM family, first FPGAs to deploy copper interconnect,
offers the performance and high memory bandwidth for
advanced system integration without the initial investment,
long development cycles, and inventory risk expected in tra-
ditional ASIC development.
© 2000-2014 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS025-1 (v3.0) March 21, 2014
Production Product Specification
www.xilinx.com
Module 1 of 4
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XCV812E-6BGG560I Related Products

XCV812E-6BGG560I XCV812E-8BGG560C
Description Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, CMOS, PBGA560, PLASTIC, BGA-560 Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 416MHz, CMOS, PBGA560, PLASTIC, BGA-560
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker XILINX XILINX
Parts packaging code BGA BGA
package instruction LBGA, LBGA,
Contacts 560 560
Reach Compliance Code compliant compliant
ECCN code 3A001.A.7.A 3A001.A.7.A
maximum clock frequency 357 MHz 416 MHz
Combined latency of CLB-Max 0.47 ns 0.4 ns
JESD-30 code S-PBGA-B560 S-PBGA-B560
JESD-609 code e1 e1
length 42.5 mm 42.5 mm
Humidity sensitivity level 3 3
Configurable number of logic blocks 4704 4704
Equivalent number of gates 254016 254016
Number of terminals 560 560
Maximum operating temperature 85 °C 70 °C
organize 4704 CLBS, 254016 GATES 4704 CLBS, 254016 GATES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Certification status Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.7 mm
Maximum supply voltage 1.89 V 1.89 V
Minimum supply voltage 1.71 V 1.71 V
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 42.5 mm 42.5 mm
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