SRAM Module, 256KX8, 150ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | PGA |
| package instruction | APGA, PGA50,5X10 |
| Contacts | 50 |
| Reach Compliance Code | unknow |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 150 ns |
| Other features | USER CONFIGURABLE AS 128K X 16 |
| I/O type | COMMON |
| JESD-30 code | R-CPGA-P50 |
| JESD-609 code | e0 |
| length | 25.146 mm |
| memory density | 2097152 bi |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 50 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | APGA |
| Encapsulate equivalent code | PGA50,5X10 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, PIGGYBACK |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 7.4676 mm |
| Maximum standby current | 0.0007 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.16 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| width | 13.716 mm |
| Base Number Matches | 1 |
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