DPS128X16Y3-10I datasheet, PDF

DPS128X16Y3-10I: DescriptionSRAM Module, 256KX8, 100ns, CMOS, CQCC48, LEADLESS, SLCC-48; Categorystorage storage; File Size220KB，10 Pages; ManufacturerTwilight Technology Inc.

Download Datasheet Parametric View All

DPS128X16Y3-10I Overview

SRAM Module, 256KX8, 100ns, CMOS, CQCC48, LEADLESS, SLCC-48

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	LCC
package instruction	AQCCN, LCC48,.5X.87
Contacts	48
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	100 ns
Other features	USER CONFIGURABLE AS 128K X 16
I/O type	COMMON
JESD-30 code	R-CQCC-N48
length	22.098 mm
memory density	2097152 bi
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	AQCCN
Encapsulate equivalent code	LCC48,.5X.87
Package shape	RECTANGULAR
Package form	CHIP CARRIER, PIGGYBACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.3434 mm
Maximum standby current	0.00017 A
Minimum standby current	2 V
Maximum slew rate	0.15 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12.7 mm
Base Number Matches	1

Software and some data used by Stellaris LM4F120 LaunchPad: [font=Tahoma,]Official website Stellaris LM4F120 LaunchPad information[/font] [url]http://pan.baidu.com/disk/home?sr=fc#dir/path=%2FCCS5.2%2FStellaris%20LM4F120%20LaunchPad[/url] Here are almost all t...; mxj1005071012 Microcontroller MCU

Competition and risk-taking phenomena in FPGA devices and their elimination methods: In digital circuit design, it is often necessary to consider the problems caused by competition and risk. This problem is particularly obvious after using FPGA devices. In order to improve system perf...; zhengzhong FPGA/CPLD

How to learn this new skill? I want to use the HAL library of STM32 and I want to use cubemx software: 1. I want to use the HAL library of STM32 and generate the corresponding program using the cubemx software provided by ST. How would you start if you want to do these two? Now I don't know anything ab...; shijizai stm32/stm8

Request a copy of the PPT version of "Entering the Door of Embedded Development_Liu Xianyu": Does anyone have this version? Can you share it? I'd like to congratulate you....; zcgzanne Embedded System

vxworks module loading: I use Tornado2.2 (vxworks5.5) to create a file system FAT16 format on the virtual machine, and transfer the application module api.o from Windows to the target machine vxworks via ftp. The file can be...; feigou Real-time operating system RTOS

What's going on with the awards ceremony on December 3rd?: [i=s] This post was last edited by paulhyde on 2014-9-15 03:41 [/i] What is the situation of the award ceremony on December 3rd of the 2011 Electronic Design Competition?...; wyzamazon Electronics Design Contest

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components