DPS128X16BA3-20M datasheet, PDF

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DPS128X16BA3-20M: DescriptionSRAM Module, 128KX16, 20ns, CMOS, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size577KB，10 Pages; ManufacturerTwilight Technology Inc.

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DPS128X16BA3-20M Overview

SRAM Module, 128KX16, 20ns, CMOS, CERAMIC, MODULE, SLCC, PGA-50

DPS128X16BA3-20M Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	APGA, PGA50,5X10
Contacts	50
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	20 ns
Other features	ALSO CAN BE CONFIGURED AS 128K X 16
Spare memory width	8
I/O type	COMMON
JESD-30 code	R-XPGA-P50
length	25.146 mm
memory density	2097152 bi
Memory IC Type	SRAM MODULE
memory width	16
Number of functions	1
Number of terminals	50
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX16
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	APGA
Encapsulate equivalent code	PGA50,5X10
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum seat height	7.4676 mm
Maximum standby current	0.0036 A
Minimum standby current	2 V
Maximum slew rate	0.32 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13.716 mm
Base Number Matches	1

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256Kx8/128Kx16, 20 - 45ns, STACK/PGA

30A097-32

2 Megabit High Speed CMOS SRAM

DPS128X16Cn3/DPS128X16Bn3

DESCRIPTION:

The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM ‘’STACK’’

modules are a revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or

mounted on a 50-pin PGA co-fired ceramic substrate. The module

packs 2-Megabits of low-power CMOS static RAM in an area as small

as 0.463 in

, while maintaining a total height as low as 0.171 inches.

The DPS128X16Cn3/DPS128X16Bn3 STACK modules contain two

individual 128K x 8 SRAMs, each packaged in a hermetically sealed

SLCC, making the modules suitable for commercial, industrial and

military applications.

The DPS128X16Bn3 has one active low Chip Enable (CE) and while the

DPS128X16Cn3 an active low Chip Enable (CE) and an active high

Select Line (SEL).

By using SLCCs, the ‘’Stack’’ family of modules offer a higher board

density of memory than available with conventional through-hole,

surface mount or hybrid techniques.

SLCC Stack

Straight Leaded

Stack

FEATURES:

•

Organizations Available: 128Kx16 or 256Kx8

Access Times: 20, 25, 30, 35, 45ns

Fully Static Operation - No clock or refresh required

Single +5V Power Supply,

10% Tolerance

TTL Compatible

Common Data Inputs and Outputs

Low Data Retention Voltage: 2.0V min.

Packages Available:

48 - Pin SLCC Stack

48 - Pin Straight Leaded Stack

48 - Pin ‘’J’’ Leaded Stack

48 - Pin Gullwing Leaded Stack

50 - Pin PGA Dense-Stack

‘’J’’ Leaded

Stack

Dense-Stack

Gullwing

Leaded Stack

30A097-32

REV. G

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

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