8-BIT, MROM, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC52,.8SQ |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| Has ADC | YES |
| Address bus width | 16 |
| bit size | 8 |
| CPU series | 6800 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | YES |
| External data bus width | 8 |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e0 |
| length | 19.1262 mm |
| Number of I/O lines | 38 |
| Number of terminals | 52 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 12288 |
| ROM programmability | MROM |
| Maximum seat height | 4.57 mm |
| speed | 3 MHz |
| Maximum slew rate | 27 mA |
| Maximum supply voltage | 5 V |
| Minimum supply voltage | 5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.1262 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC68HC11E9MFN1 | MC68HC11E1FN | MC68HC11E9VFN1 | MC68HC11E1VFN | MC68HC11E0FN | MC68HC11E1MFN | |
|---|---|---|---|---|---|---|
| Description | 8-BIT, MROM, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52 | 8-BIT, EEPROM, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52 | 8-BIT, MROM, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52 | Microcontroller, 8-Bit, 3MHz, CMOS, PQCC52, PLASTIC, LCC-52 | 8-BIT, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52 | 8-BIT, 3MHz, MICROCONTROLLER, PQCC52, PLASTIC, LCC-52 |
| package instruction | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| Has ADC | YES | YES | YES | YES | YES | YES |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO |
| DMA channel | YES | YES | YES | YES | YES | YES |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 |
| length | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
| Number of I/O lines | 38 | 38 | 38 | 38 | 38 | 38 |
| Number of terminals | 52 | 52 | 52 | 52 | 52 | 52 |
| Maximum operating temperature | 125 °C | 85 °C | 105 °C | 105 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM channel | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| speed | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz |
| Maximum supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Minimum supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| width | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| Parts packaging code | LCC | LCC | LCC | - | LCC | LCC |
| Contacts | 52 | 52 | 52 | - | 52 | 52 |
| CPU series | 6800 | 6800 | 6800 | - | 6800 | 6800 |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 |
| Encapsulate equivalent code | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | - | LDCC52,.8SQ | LDCC52,.8SQ |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| RAM (bytes) | 512 | 512 | 512 | - | 512 | 512 |
| Maximum slew rate | 27 mA | 27 mA | 27 mA | - | 27 mA | 27 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |