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UN2154

Description
Composite Device - Transistors with built-in Resistor
CategoryDiscrete semiconductor    The transistor   
File Size30KB,2 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance
Download Datasheet Parametric Compare View All

UN2154 Overview

Composite Device - Transistors with built-in Resistor

UN2154 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPanasonic
Parts packaging codeSC-59
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresBUILT IN BIAS RESISTOR RATIO IS 4.76
Maximum collector current (IC)0.1 A
Collector-emitter maximum voltage30 V
ConfigurationSINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)80
JESD-30 codeR-PDSO-G3
Number of components1
Number of terminals3
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typePNP
Maximum power dissipation(Abs)0.2 W
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)80 MHz
Transistors with built-in Resistor
UN2154
Silicon PNP epitaxial planer transistor
2.8
–0.3
+0.2
Unit: mm
0.65±0.15
For digital circuits
0.65±0.15
1.5
–0.05
+0.25
2.9
–0.05
0.95
q
q
q
High forward current transfer ratio h
FE
.
Costs can be reduced through downsizing of the equipment and
reduction of the number of parts.
Mini type package, allowing downsizing of the equipment and
automatic insertion through tape packing and magazine packing.
1.9±0.2
+0.2
s
Features
0.95
1
3
1.45
0 to 0.1
2
1.1
–0.1
s
Absolute Maximum Ratings
Parameter
Collector to base voltage
Collector to emitter voltage
Collector current
Total power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
I
C
P
T
T
j
T
stg
(Ta=25˚C)
Ratings
–30
–30
–100
200
150
–55 to +150
Unit
V
V
mA
mW
˚C
˚C
0.1 to 0.3
0.4±0.2
1:Base
2:Emitter
3:Collector
0.8
EIAJ:SC-59
Mini Type Package
Marking Symbol:
EV
Internal Connection
R1(10kΩ)
C
B
R2
(47kΩ)
E
s
Electrical Characteristics
Parameter
Collector to base voltage
Collector to emitter voltage
Collector cutoff current
Emitter cutoff current
Forward current transfer ratio
Collector to emitter saturation voltage
Output voltage high level
Output voltage low level
Input resistance
Resistance ratio
Transition frequency
(Ta=25˚C)
Symbol
V
CBO
V
CEO
I
CBO
I
CEO
I
EBO
h
FE
V
CE(sat)
V
OH
V
OL
R
1
R
1
/R
2
f
T
V
CB
= –10V, I
E
= 1mA, f = 200MHz
Conditions
I
C
= –10µA, I
E
= 0
I
C
= –2mA, I
B
= 0
V
CB
= –30V, I
E
= 0
V
CE
= –30V, I
B
= 0
V
EB
= –3V, I
C
= 0
V
CE
= –10V, I
C
= –5mA
I
C
= –50mA, I
B
= – 0.33mA
V
CC
= –5V, V
B
= – 0.5V, R
L
= 1kΩ
V
CC
= –5V, V
B
= –2.5V, R
L
= 1kΩ
–30%
10
0.213
80
–4.9
– 0.2
+30%
80
– 0.5
–1.2
min
–30
–30
– 0.1
– 0.5
– 0.1
typ
max
Unit
V
V
µA
µA
mA
V
V
V
kΩ
MHz
0.16
–0.06
+0.2
+0.1
0.4
–0.05
+0.1
1

UN2154 Related Products

UN2154 XP6435
Description Composite Device - Transistors with built-in Resistor Composite Device - Transistors with built-in Resistor
Is it Rohs certified? conform to conform to
Parts packaging code SC-59 SC-88
package instruction SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G6
Contacts 3 6
Reach Compliance Code unknow unknow
ECCN code EAR99 EAR99
Maximum collector current (IC) 0.1 A 0.03 A
Collector-emitter maximum voltage 30 V 20 V
Configuration SINGLE WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS
Minimum DC current gain (hFE) 80 50
JESD-30 code R-PDSO-G3 R-PDSO-G6
Number of components 1 2
Number of terminals 3 6
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
Polarity/channel type PNP PNP
Maximum power dissipation(Abs) 0.2 W 0.15 W
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 10 10
transistor applications SWITCHING AMPLIFIER
Transistor component materials SILICON SILICON
Nominal transition frequency (fT) 80 MHz 150 MHz

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