F-217
TLE–107–01–G–DV
TLE–115–01–G–DV
TLE–135–01–G–DV
(2.00 mm) .0787"
TLE SERIES
COST-EFFECTIVE RELIABLE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TLE
Insulator Material:
Black Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating (TLE/TMMH):
3.2 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(2.08 mm) .082" to
(4.37 mm) .172" with
(0.38 mm) .015" wipe,
pass-through, or
(3.35 mm) .132" min
for bottom entry
RoHS Compliant:
Yes
Mates with:
TMMH, TMM,
MTMM, MMT,
TW, LTMM,
ZLTMM, TCMD,
TSH
Tiger Beam
TM
contacts
Ideal for
pass-through
applications
OPTIONS
–P OPTION
Available
with optional
pick & place pads
Surface
mount
–A OPTION
–TR OPTION
(2.00 mm) .0787"
micro pitch
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-26)
(0.15 mm) .006" max (27-50)
TLE
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
02 thru 50
= 10 µ" (0.25 µm)
Gold
–G
= Alignment Pin
(3 positions minimum)
–A
–K
–P
= (5.00 mm) .197" DIA
Polyimide Film Pick & Place Pad
(3 positions minimum)
(2.00)
.0787
01
No. of positions x
(2.00) .0787
(2.00)
.0787
(4.00)
.157
(5.08)
.200
x
(5.71)
.225
(4.70)
.185
–P Option
= Metal Pick & Place Pad
(4 positions minimum)
= Tape & Reel Packaging
(2-37 positions only)
–TR
02
(0.56)
.022
(4.32)
.170
(4.50)
.177
(5.51)
.217
(0.76)
.030
(0.64)
.025
DIA
–A Option
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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