Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr Inductor Type > Chip Ferrite Beads
Data Sheet
1
Chip EMIFILr Inductor Type
Chip Ferrite Beads
BLM31B Series (1206 Size)
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For your new designs, alternative parts should be used. These parts should be used only for existing design. Please consult with us for details.
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Dimension
0.7±0.3
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Equivalent Circuit
3.2±0.2
1.6±0.2
1.1±0.2
in mm
(Resistance element becomes dominant
at high frequencies.)
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Packaging
Code
L
K
B
Packaging
180mm Embossed Tape
330mm Embossed Tape
Bulk(Bag)
Minimum Quantity
3000
10000
1000
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Rated Value (p: packaging code)
Part Number
BLM31BE601FN1p
Impedance
(at 100MHz/20°C)
600ohm±25%
Impedance
(at 1GHz/20°C)
-
Rated Current
300mA
DC Resistance(max.)
0.35ohm
Operating
Temperature Range
-55°C to +125°C
Number of Circuits
1
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Impedance-Frequency Characteristics
BLM31BE601FN1
800
Z
600
R
Impedance (Ω)
400
200
X
0
1
10
100
Frequency (MHz)
1000 2000
Continued on the following page.
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This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
!
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
2007.11.1
http://www.murata.com/
Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr Inductor Type > Chip Ferrite Beads
Data Sheet
Continued from the preceding page.
2
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!Caution/Notice
!Caution
(Rating)
Do not use products beyond the rated current and
rated voltage as this may create excessive heat
and deteriorate the insulation resistance.
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
o
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
!
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
2007.11.1
http://www.murata.com/
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