IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| Number of terminals | 68 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| DP8420V | DP8422V-20 | DP8420V-25 | DP8421V | DP8421V-25 | DP8422V | DP8420V-20 | |
|---|---|---|---|---|---|---|---|
| Description | IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN | IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | S-PQCC-J68 | S-PQCC-J84 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J84 | S-PQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 68 | 84 | 68 | 68 | 68 | 84 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LDCC84,1.2SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC84,1.2SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum slew rate | - | 75 mA | 95 mA | - | 95 mA | - | 75 mA |