DP8422V-20 datasheet, PDF - EEWORLD Datasheet

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DP8422V-20: DescriptionIC,MEMORY CONTROLLER,CMOS,LDCC,84PIN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，60 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DP8422V-20 Overview

IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN

DP8422V-20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCJ, LDCC84,1.2SQ
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-J84
JESD-609 code	e0
Number of terminals	84
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	75 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

DP8422V-20 Related Products

	DP8422V-20	DP8420V	DP8420V-25	DP8421V	DP8421V-25	DP8422V	DP8420V-20
Description	IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	QCCJ, LDCC84,1.2SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC84,1.2SQ	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	S-PQCC-J84	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J84	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	84	68	68	68	68	84	68
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC84,1.2SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum slew rate	75 mA	-	95 mA	-	95 mA	-	75 mA

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