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DP8481F/A+

Description
IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,FP,16PIN,CERAMIC
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size75KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DP8481F/A+ Overview

IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,FP,16PIN,CERAMIC

DP8481F/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDFP, FL16,.3
Reach Compliance Codeunknown
Interface integrated circuit typeTTL TO ECL TRANSLATOR
JESD-30 codeR-XDFP-F16
JESD-609 codee0
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5,-5.2 V
surface mountYES
technologyECL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL

DP8481F/A+ Related Products

DP8481F/A+ DP8481N/A+ DP8481N/B+ DP8481J/A+
Description IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,FP,16PIN,CERAMIC IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,PLASTIC IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,PLASTIC IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown
Interface integrated circuit type TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR
JESD-30 code R-XDFP-F16 R-PDIP-T16 R-PDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0
Number of terminals 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DFP DIP DIP DIP
Encapsulate equivalent code FL16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE IN-LINE IN-LINE
power supply 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V
surface mount YES NO NO NO
technology ECL ECL ECL ECL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL

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