IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Interface integrated circuit type | TTL TO ECL TRANSLATOR |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,-5.2 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | ECL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DP8481N/B+ | DP8481F/A+ | DP8481N/A+ | DP8481J/A+ | |
|---|---|---|---|---|
| Description | IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,PLASTIC | IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,FP,16PIN,CERAMIC | IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,PLASTIC | IC,TTL-TO-ECL TRANSLATOR,ECL/TTL,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Interface integrated circuit type | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR |
| JESD-30 code | R-PDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DFP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
| power supply | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| surface mount | NO | YES | NO | NO |
| technology | ECL | ECL | ECL | ECL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |