UPD780021ASGB(A)-XXX-8ET-A datasheet, PDF - EEWORLD Datasheet

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UPD780021ASGB(A)-XXX-8ET-A: Description8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，345 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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UPD780021ASGB(A)-XXX-8ET-A Overview

8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52

UPD780021ASGB(A)-XXX-8ET-A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	10 X 10 MM, PLASTIC, LQFP-52
Contacts	52
Reach Compliance Code	compliant
Has ADC	YES
Other features	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ
Address bus width
bit size	8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G52
JESD-609 code	e6
length	10 mm
Number of I/O lines	39
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	12 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN BISMUTH
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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User’s Manual

µ

PD780024AS, 780034AS Subseries

8-Bit Single-Chip Microcontrollers

µ

PD780021AS

µ

PD780022AS

µ

PD780023AS

µ

PD780024AS

µ

PD780031AS

µ

PD780032AS

µ

PD780033AS

µ

PD780034AS

µ

PD78F0034BS

µ

PD780021AS(A)

µ

PD780022AS(A)

µ

PD780023AS(A)

µ

PD780024AS(A)

µ

PD780031AS(A)

µ

PD780032AS(A)

µ

PD780033AS(A)

µ

PD780034AS(A)

µ

PD78F0034BS(A)

Document No. U16035EJ2V0UD00 (2nd edition)

Date Published September 2002 N CP(K)

©

2002

Printed in Japan

NOTES FOR CMOS DEVICES

1

PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

2

HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to V

DD

or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

3

STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

FIP, EEPROM, and IEBus are trademarks of NEC Corporation.

Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the

United States and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company.

SPARCstation is a trademark of SPARC International, Inc.

Solaris and SunOS are trademarks of Sun Microsystems, Inc.

Ethernet is a trademark of Xerox Corporation.

OSF/Motif is a trademark of OpenSoftware Foundation, Inc.

TRON stands for The Realtime Operating system Nucleus.

ITRON is an abbreviation of Industrial TRON.

User’s Manual U16035EJ2V0UD

3

The export of these products from Japan is regulated by the Japanese government. The export of some or all of these

products may be prohibited without governmental license. To export or re-export some or all of these products from a

country other than Japan may also be prohibited without a license from that country. Please call an NEC sales

representative.

License not needed:

µ

PD78F0034BSGB-8ET, 78F0034BSGB(A)-8ET

The customer must judge the need for a license for the following products:

µ

PD780021ASGB-xxx-8ET, 780022ASGB-xxx-8ET, 780023ASGB-xxx-8ET, 780024ASGB-xxx-8ET,

µ

PD780031ASGB-xxx-8ET, 780032ASGB-xxx-8ET, 780033ASGB-xxx-8ET, 780034ASGB-xxx-8ET,

µ

PD780021ASGB(A)-xxx-8ET, 780022ASGB(A)-xxx-8ET, 780023ASGB(A)-xxx-8ET,

µ

PD780024ASGB(A)-xxx-8ET, 780031ASGB(A)-xxx-8ET, 780032ASGB(A)-xxx-8ET,

µ

PD780033ASGB(A)-xxx-8ET, 780034ASGB(A)-xxx-8ET

•

The information in this document is current as of June, 2002. The information is subject to change

without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data

books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products

and/or types are available in every country. Please check with an NEC sales representative for

availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

•

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of NEC semiconductor products listed in this document or any other

liability arising from the use of such products. No license, express, implied or otherwise, is granted under any

patents, copyrights or other intellectual property rights of NEC or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of customer's equipment shall be done under the full

responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third

parties arising from the use of these circuits, software and information.

•

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers

agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize

risks of damage to property or injury (including death) to persons arising from defects in NEC

semiconductor products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment, and anti-failure features.

•

NEC semiconductor products are classified into the following three quality grades:

"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products

developed based on a customer-designated "quality assurance program" for a specific application. The

recommended applications of a semiconductor product depend on its quality grade, as indicated below.

Customers must check the quality grade of each semiconductor product before using it in a particular

application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's

data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not

intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness

to support a given application.

(Note)

(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

M8E 00. 4

4

User’s Manual U16035EJ2V0UD

UPD780021ASGB(A)-XXX-8ET-A Related Products

	UPD780021ASGB(A)-XXX-8ET-A	UPD780023ASGB(A)-XXX-8ET-A	UPD780024ASGB(A)-XXX-8ET-A	UPD780034ASGB(A)-XXX-8ET-A	UPD780022ASGB(A)-XXX-8ET-A
Description	8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	UPD780022ASGB(A)-XXX-8ET-A
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Parts packaging code	QFP	QFP	QFP	QFP	LQFP
package instruction	10 X 10 MM, PLASTIC, LQFP-52	10 X 10 MM, PLASTIC, LQFP-52	LQFP,	10 X 10 MM, PLASTIC, LQFP-52	LQFP,
Contacts	52	52	52	52	52
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Has ADC	YES	YES	YES	YES	YES
Other features	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ	OPERATES AT 1.8V MINIMUM SUPPLY @ 5 MHZ
bit size	8	8	8	8	8
maximum clock frequency	12 MHz	12 MHz	12 MHz	12 MHz	12 MHz
DAC channel	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO
JESD-30 code	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52
JESD-609 code	e6	e6	e6	e6	e6
length	10 mm	10 mm	10 mm	10 mm	10 mm
Number of I/O lines	39	39	39	39	39
Number of terminals	52	52	52	52	52
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	MROM	MROM	MROM	MROM	MROM
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
speed	12 MHz	12 MHz	12 MHz	12 MHz	12 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	10 mm	10 mm	10 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	-
Base Number Matches	-	1	1	1	1

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