LM6142MDC datasheet, PDF - EEWORLD Datasheet

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LM6142MDC: DescriptionIC DUAL OP-AMP, UUC, DIE, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size484KB，18 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LM6142MDC Overview

IC DUAL OP-AMP, UUC, DIE, Operational Amplifier

LM6142MDC Parametric

Parameter Name	Attribute value
Maker	National Semiconductor（TI ）
Parts packaging code	WAFER
package instruction	DIE, DIE OR CHIP
Reach Compliance Code	unknown
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES
JESD-30 code	X-XUUC-N
low-bias	NO
low-dissonance	NO
micropower	NO
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	2
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
power	NO
power supply	1.8/24 V
Programmable power	NO
Certification status	Not Qualified
Supply voltage upper limit	35 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
broadband	NO

LM6142MDC Related Products

	LM6142MDC	LM6142BIMWC	LM6142BIMDC
Description	IC DUAL OP-AMP, UUC, DIE, Operational Amplifier	IC DUAL OP-AMP, 2500 uV OFFSET-MAX, 9 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier	IC DUAL OP-AMP, 2500 uV OFFSET-MAX, 9 MHz BAND WIDTH, UUC, DIE, Operational Amplifier
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	WAFER	WAFER	WAFER
package instruction	DIE, DIE OR CHIP	DIE, WAFER	DIE, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES	YES	YES
JESD-30 code	X-XUUC-N	X-XUUC-N	X-XUUC-N
low-bias	NO	NO	NO
low-dissonance	NO	NO	NO
micropower	NO	NO	NO
Number of functions	2	2	2
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE
Encapsulate equivalent code	DIE OR CHIP	WAFER	DIE OR CHIP
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
power	NO	NO	NO
power supply	1.8/24 V	1.8/24 V	1.8/24 V
Programmable power	NO	NO	NO
Certification status	Not Qualified	Not Qualified	Not Qualified
Supply voltage upper limit	35 V	35 V	35 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER
broadband	NO	NO	NO
Maximum average bias current (IIB)	-	0.3 µA	0.3 µA
Maximum bias current (IIB) at 25C	-	0.3 µA	0.3 µA
Nominal Common Mode Rejection Ratio	-	76 dB	76 dB
Maximum input offset voltage	-	2500 µV	2500 µV
minimum slew rate	-	11 V/us	11 V/us
Maximum slew rate	-	2.3 mA	2.3 mA
Nominal Uniform Gain Bandwidth	-	9000 kHz	9000 kHz
Minimum voltage gain	-	25000	25000

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