|
LM4946TMX/NOPB |
LM4946TM/NOPB |
LM4946SQX |
| Description |
IC 1.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA25, ROHS COMPLIANT, MICRO, BUMP, SMD-25, Audio/Video Amplifier |
IC 1.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA25, ROHS COMPLIANT, MICRO, BUMP, SMD-25, Audio/Video Amplifier |
IC 1.3 W, 2 CHANNEL, AUDIO AMPLIFIER, QCC24, LLP-24, Audio/Video Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
incompatible |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| package instruction |
FBGA, BGA25,5X5,16 |
FBGA, BGA25,5X5,16 |
LLP-24 |
| Reach Compliance Code |
compliant |
compliant |
not_compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
| JESD-30 code |
S-PBGA-B25 |
S-PBGA-B25 |
S-XQCC-N24 |
| JESD-609 code |
e1 |
e1 |
e0 |
| length |
2 mm |
2 mm |
4 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of channels |
2 |
2 |
2 |
| Number of functions |
1 |
1 |
1 |
| Number of terminals |
25 |
25 |
24 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Nominal output power |
1.3 W |
1.3 W |
1.3 W |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
| encapsulated code |
FBGA |
FBGA |
HVQCCN |
| Encapsulate equivalent code |
BGA25,5X5,16 |
BGA25,5X5,16 |
LCC24,.16SQ,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power supply |
3.3/5 V |
3.3/5 V |
3.3/5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
| surface mount |
YES |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
NO LEAD |
| Terminal pitch |
0.4 mm |
0.4 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
QUAD |
| Maximum time at peak reflow temperature |
40 |
40 |
40 |
| width |
2 mm |
2 mm |
4 mm |
| Maximum slew rate |
10.5 mA |
10.5 mA |
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