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LC7363NM

Description
Telephone Dialer Circuit, CMOS, PDSO30, MFP-30
CategoryWireless rf/communication    Telecom circuit   
File Size386KB,9 Pages
ManufacturerSANYO
Websitehttp://www.semic.sanyo.co.jp/english/index-e.html
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LC7363NM Overview

Telephone Dialer Circuit, CMOS, PDSO30, MFP-30

LC7363NM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSANYO
Parts packaging codeDFP
package instructionSSOP, SOP30,.4,40
Contacts30
Reach Compliance Codeunknown
Other features2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE
crystal frequency3.58 MHz
JESD-30 codeR-PDSO-G30
JESD-609 codee0
length15.3 mm
damage rate1:2
Number of functions1
Number of terminals30
Maximum operating temperature70 °C
Minimum operating temperature-30 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSOP30,.4,40
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.5/6 V
Certification statusNot Qualified
Maximum seat height2.5 mm
Maximum slew rate0.001 mA
Nominal supply voltage3.5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELEPHONE DIALER CIRCUIT
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.9 mm

LC7363NM Related Products

LC7363NM LC7363N
Description Telephone Dialer Circuit, CMOS, PDSO30, MFP-30 Telephone Dialer Circuit, CMOS, PDIP22, SDIP-22
Is it Rohs certified? incompatible incompatible
Maker SANYO SANYO
Parts packaging code DFP DIP
package instruction SSOP, SOP30,.4,40 SDIP, SDIP22,.3
Contacts 30 22
Reach Compliance Code unknown unknown
Other features 2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE 2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE
crystal frequency 3.58 MHz 3.58 MHz
JESD-30 code R-PDSO-G30 R-PDIP-T22
JESD-609 code e0 e0
length 15.3 mm 21.2 mm
damage rate 1:2 1:2
Number of functions 1 1
Number of terminals 30 22
Maximum operating temperature 70 °C 70 °C
Minimum operating temperature -30 °C -30 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SDIP
Encapsulate equivalent code SOP30,.4,40 SDIP22,.3
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 1.5/6 V 1.5/6 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.5 mm 3.9 mm
Maximum slew rate 0.001 mA 0.001 mA
Nominal supply voltage 3.5 V 3.5 V
surface mount YES NO
technology CMOS CMOS
Telecom integrated circuit types TELEPHONE DIALER CIRCUIT TELEPHONE DIALER CIRCUIT
Temperature level OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE
Terminal pitch 1 mm 1.778 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 7.9 mm 7.62 mm
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