LC7363N datasheet, PDF - EEWORLD Datasheet

LC7363N: DescriptionTelephone Dialer Circuit, CMOS, PDIP22, SDIP-22; CategoryWireless rf/communication Telecom circuit; File Size386KB，9 Pages; ManufacturerSANYO; Websitehttp://www.semic.sanyo.co.jp/english/index-e.html

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LC7363N Overview

Telephone Dialer Circuit, CMOS, PDIP22, SDIP-22

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SANYO
Parts packaging code	DIP
package instruction	SDIP, SDIP22,.3
Contacts	22
Reach Compliance Code	unknown
Other features	2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE
crystal frequency	3.58 MHz
JESD-30 code	R-PDIP-T22
JESD-609 code	e0
length	21.2 mm
damage rate	1:2
Number of functions	1
Number of terminals	22
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP22,.3
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.5/6 V
Certification status	Not Qualified
Maximum seat height	3.9 mm
Maximum slew rate	0.001 mA
Nominal supply voltage	3.5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	TELEPHONE DIALER CIRCUIT
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

	LC7363N	LC7363NM
Description	Telephone Dialer Circuit, CMOS, PDIP22, SDIP-22	Telephone Dialer Circuit, CMOS, PDSO30, MFP-30
Is it Rohs certified?	incompatible	incompatible
Maker	SANYO	SANYO
Parts packaging code	DIP	DFP
package instruction	SDIP, SDIP22,.3	SSOP, SOP30,.4,40
Contacts	22	30
Reach Compliance Code	unknown	unknown
Other features	2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE	2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE
crystal frequency	3.58 MHz	3.58 MHz
JESD-30 code	R-PDIP-T22	R-PDSO-G30
JESD-609 code	e0	e0
length	21.2 mm	15.3 mm
damage rate	1:2	1:2
Number of functions	1	1
Number of terminals	22	30
Maximum operating temperature	70 °C	70 °C
Minimum operating temperature	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	SSOP
Encapsulate equivalent code	SDIP22,.3	SOP30,.4,40
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	1.5/6 V	1.5/6 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	3.9 mm	2.5 mm
Maximum slew rate	0.001 mA	0.001 mA
Nominal supply voltage	3.5 V	3.5 V
surface mount	NO	YES
technology	CMOS	CMOS
Telecom integrated circuit types	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	1.778 mm	1 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.9 mm

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