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NCP5369

Description
AND GATE BASED MOSFET DRIVER, QCC40
Categorysemiconductor    Analog mixed-signal IC   
File Size70KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

NCP5369 Overview

AND GATE BASED MOSFET DRIVER, QCC40

NCP5369 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals40
Maximum operating temperature100 Cel
Minimum operating temperature-10 Cel
Maximum supply voltage 125 V
Minimum supply voltage 14.5 V
Rated supply voltage 112 V
Processing package description6 × 6 MM, 0.50 MM PITCH, LEAD FREE, QFN-40
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeSQUARE
Package SizeChip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.5000 mm
terminal coatingMATTE Tin
Terminal locationFour
Packaging MaterialsUNSPECIFIED
Temperature levelother
high end driverYes
Interface TypeAND gate FET driver
NCP5369
Integrated Driver and
MOSFET
The NCP5369 integrates a MOSFET driver, high−side MOSFET
and low−side MOSFET into a 6 mm x 6 mm 40−pin QFN package.
The driver and MOSFETs have been optimized for high−current
DC−DC buck power conversion applications. The NCP5369
integrated solution greatly reduces package parasitics and board space
compared to a discrete component solution.
Features
www.onsemi.com
MARKING
DIAGRAM
1
Capable of Switching Frequencies Up to 1 MHz
Capable of Output Currents Up to 35 A
Internal Bootstrap Diode
Zero Current Detection
Undervoltage Lockout
Internal Thermal Warning / Thermal Shutdown
These are Pb−Free Devices
5V
12−20 V
1 40
QFN40
MN SUFFIX
CASE 485AZ
A
WL
YY
WW
G
NCP5369
AWLYYWWG
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Thermal
Warning
5V
THWN
VCIN
ZCD Enable
Output
Disable
PWM
ZCD_EN#
PHASE
DISB#
VSWH
PWM
CGND
PGND
Vout
VIN
BOOT
ORDERING INFORMATION
Device
NCP5369MNR2G
Package
Shipping
QFN40
2500/Tape & Reel
(Pb−Free)
QFN40
2500/Tape & Reel
(Pb−Free)
NCP5369MNTWG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Application Schematic
©
Semiconductor Components Industries, LLC, 2015
1
April, 2015 − Rev. 5
Publication Order Number:
NCP5369/D
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