EEWORLDEEWORLDEEWORLD

Part Number

Search

HY27US16121A-FEP

Description
Flash, 32MX16, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
Categorystorage    storage   
File Size414KB,49 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance  
Download Datasheet Parametric View All

HY27US16121A-FEP Overview

Flash, 32MX16, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63

HY27US16121A-FEP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeBGA
package instructionVFBGA, BGA63,10X12,32
Contacts63
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time30 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B63
JESD-609 codee0
length11 mm
memory density536870912 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size4K
Number of terminals63
word count33554432 words
character code32000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA63,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size256 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Programming voltage3.3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size8K
Maximum standby current0.00005 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeSLC NAND TYPE
width9 mm
HY27US(08/16)121A Series
HY27SS(08/16)121A Series
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
Document Title
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory
Revision History
Revision
No.
0.0
Initial Draft.
History
Draft Date
Sep. 2004
Remark
Preliminary
0.1
1) Correct part number ( change mode)
- 2A -> 1A (sequential row read : disable -> enable)
2) Correct Table.5 & Table 12
- Correct Command Set
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)
3) Correct Summary description & page.7
- The cache feature is deleted in summary description.
Oct. 22. 2004
- Note.3 is deleted. (page.7)
4) Add System interface using CE don’t care (page. 38)
5) Change TSOP1, WSOP1,FBGA package dimension & figures.
- Change TSOP1, WSOP1, FBGA package mechanical data
- Change TSOP1, WSOP package figures
6) Correct TSOP1, WSOP1 Pin configuration
- 38th NC pin has been changed Lockpre (figure 2,3)
7) Add Bad block Management
1) LOCKPRE is changed to PRE
- Texts, Table and figures are changed.
2) Change Command set
- Read A,B are changed to Read1.
- Read C is changed to Read2.
3) Change AC, DC characterics
Preliminary
0.2
- tRB, tCRY, tCEH and tOH are added.
4) Correct Program time (max)
- before : 700us
- after
: 500us
5) Edit figures
- Address names are changed.
6) Change FBGA Package Dimension
- FD1 : 1.70(before) -> 0.90(after)
Mar. 08. 2005 Preliminary
Rev 1.3 / Jun. 2006
1
About E2PROM,24C01
Do the pins connecting 24C01 and the microcontroller only need to connect SDA and SCL? Then how should the A0, A1, A2 and WP pins be handled? Urgent......
bingda Microcontroller MCU
AM5708 platform transplants Ubuntu system and docker container
[i=s]This post was last edited by alan000345 on 2019-1-14 08:27[/i] Author: TI engineer Denny Yang AM5708 is the latest generation of ARM+DSP architecture SOC currently mass-produced by TI, with the c...
alan000345 DSP and ARM Processors
Training market directly targets employment
Employment training has further gained popularity. Vocational education, in its fundamental nature, is education for the purpose of achieving employment. As employment has become a hot topic in today'...
myq412 Embedded System
What modules need to be prepared for next year’s Hubei provincial competition?
[i=s]This post was last edited by paulhyde on 2014-9-15 09:15[/i] [size=6][color=magenta]I am a novice and need to prepare for the Hubei e-sports competition next summer. I hope experienced teachers a...
莎莎 Electronics Design Contest
[Help] Isolation of MCU and AD
My 51 microcontroller requires isolation from AD. Should the clock of ad0809 be isolated from 51 by an optocoupler or should a 500k clock signal be generated separately?...
aone2008 Industrial Control Electronics
Help msp430f6638!!!
It can be compiled, but after burning the program, it shows Can't find a source file at "/tmp/TI_MKLIB28qeec/SRC/copy_zero_init.c" Locate the file or edit the source lookup path to include its locatio...
zhangzzang Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2470  402  789  2542  2307  50  9  16  52  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号