BT8953SPEPJ datasheet, PDF - EEWORLD Datasheet

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BT8953SPEPJ: DescriptionFramer, CMOS, PQCC68, PLASTIC, LCC-68; CategoryWireless rf/communication Telecom circuit; File Size1MB，185 Pages; ManufacturerCONEXANT; Websitehttp://www.conexant.com/

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BT8953SPEPJ Overview

Framer, CMOS, PQCC68, PLASTIC, LCC-68

BT8953SPEPJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	CONEXANT
Parts packaging code	LCC
package instruction	QCCJ, LDCC68,1.0SQ
Contacts	68
Reach Compliance Code	unknown
data rate	1168 Mbps
JESD-30 code	S-PQCC-J68
JESD-609 code	e0
length	24.23 mm
Number of functions	1
Number of terminals	68
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24.23 mm

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R O C K W E L L

S E M I C O N D U C T O R

S Y S T E M S

Network

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Bt8953A/SP

HDSL Channel Unit

data sheet

PROVIDING

HIGH

SPEED

MULTIMEDIA

CONNECTIONS

Because

Communication

Matters

™

Ordering Information

Order Number

Bt8953EPF

(1)

Bt8953AEPJ

(1)

Bt8953AEPFC

Bt8953AEPJC

Bt8953SP EPF

Bt8953SP EPJ

Package

160–Pin Plastic Quad Flat Pack (PQFP)

68–Pin Plastic Leaded Chip Carrier (PLCC)

80–Pin Plastic Quad Flat Pack (PQFP)

68–Pin Plastic Leaded Chip Carrier (PLCC)

80–Pin Plastic Quad Flat Pack (PQFP)

68–Pin Plastic Leaded Chip Carrier (PLCC)

Number of

HDSL Channels

Operating Temperature Range

–40˚C to +85˚C

Notes: (1).Bt8953EPF and Bt8953EPFJ are obsoleted by Bt8953AEPJC. Refer to the Addendum for a description of differences

between Bt8953EPF and Bt8953AEPJ.

Print date: May 1998

Rockwell Semiconductor Systems, Inc. reserves the right to make changes to its products or speciﬁcations to improve performance,

reliability, or manufacturability. Information furnished is believed to be accurate and reliable. However, no responsibility is

assumed for its use; nor for any infringement of patents or other rights of third parties which may result from its use. No license is

granted by its implication or otherwise under any patent or intellectual property rights of Rockwell Semiconductor Systems, Inc.

Rockwell Semiconductor Systems, Inc. products are not designed or intended for use in life support appliances, devices, or systems

where malfunction of a Rockwell Semiconductor Systems, Inc. product can reasonably be expected to result in personal injury or

death. Rockwell Semiconductor Systems, Inc. customers using or selling Rockwell Semiconductor Systems, Inc. products for use

in such applications do so at their own risk and agree to fully indemnify Rockwell Semiconductor Systems, Inc. for any damages

resulting from such improper use or sale.

Bt is a registered trademark of Rockwell Semiconductor Systems, Inc. SLC is a registered trademark of AT&T Technologies, Inc.

Product names or services listed in this publication are for identiﬁcation purposes only, and may be trademarks or registered

trademarks of their respective companies. All other marks mentioned herein are the property of their respective holders.

Speciﬁcations are subject to change without notice.

PRINTED IN THE UNITED STATES OF AMERICA

Table of Contents

List of Figures

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

List of Tables

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

1.0 HDSL Systems

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 HTU Applications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 System Interfaces

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.0 Pin Descriptions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1 Pin Assignments

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.2 Signal Deﬁnitions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.0 Circuit Descriptions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.1 MPU Interface

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.2 PCM Channel

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.2.1 PCM Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.2 PCM Receive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 Clock Recovery DPLL

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

3.4 Loopbacks

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

3.5 HDSL Channel

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3.5.1 HDSL Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.2 HDSL Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N8953ADSC

iii

Table of Contents

Bt8953A/8953SP

HDSL Channel Unit

4.0 Bt8953 PRA Function

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.1 PRA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.2 Bt8953 Functions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

4.2.1 Transferring Data from HDSL to RSER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2.2 Deﬁnitions of Detection Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2.3 Inserting Data Transferred from HDSL to RSER . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2.4 Transferring Data from TSER to HDSL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2.5 Inserting Data Transferred from TSER to HDSL . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.0 Registers

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

5.1 Address Map

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

5.2 HDSL Transmit

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

0x00—Transmit Embedded Operations Channel (TEOC_LO). . . . . . . . . . . . . . . . . . . . . .

0x01—Transmit Embedded Operations Channel (TEOC_HI) . . . . . . . . . . . . . . . . . . . . . .

0x02—Transmit Indicator Bits (TIND_LO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x03—Transmit Indicator Bits (TIND_HI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x04—Transmit Z-Bits (TZBIT_1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x05—Transmit FIFO Water Level (TFIFO_WL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x06—Transmit Command Register 1 (TCMD_1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x07—Transmit Command Register 2 (TCMD_2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0xDF—Transmit Z-Bits (TZBIT_2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0xE0—Transmit Z-Bits (TZBIT_3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0xE1—Transmit Z-Bits (TZBIT_4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0xE2—Transmit Z-Bits (TZBIT_5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0xE3—Transmit Z-Bits (TZBIT_6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Transmit Payload Mapper

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

0x08—Transmit Payload Map (TMAP_1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x09—Transmit Payload Map (TMAP_2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0A—Transmit Payload Map (TMAP_3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0B—Transmit Payload Map (TMAP_4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0C—Transmit Payload Map (TMAP_5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0F—Transmit Payload Map (TMAP_6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x10—Transmit Payload Map (TMAP_7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x11—Transmit Payload Map (TMAP_8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x12—Transmit Payload Map (TMAP_9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0D—Transmit FIFO Reset (TFIFO_RST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x0E—Scrambler Reset (SCR_RST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 HDSL Receive

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

0x60—Receive Command Register 1 (RCMD_1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x61—Receive Command Register 2 (RCMD_2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0x62—Receive Elastic Store FIFO Reset (RFIFO_RST) . . . . . . . . . . . . . . . . . . . . . . . . . .

0x63—Receive Framer Synchronization Reset (SYNC_RST). . . . . . . . . . . . . . . . . . . . . .

N8953ADSC

BT8953SPEPJ Related Products

	BT8953SPEPJ	BT8953AEPFC	BT8953SPEPF	BT8953EPF	BT8953AEPJ	BT8953AEPJC
Description	Framer, CMOS, PQCC68, PLASTIC, LCC-68	Framer, CMOS, PQFP80, PLASTIC, MQFP-80	Framer, CMOS, PQFP80, PLASTIC, MQFP-80	Framer, CMOS, PQFP160, PLASTIC, QFP-160	Framer, CMOS, PQCC68,	Framer, CMOS, PQCC68, PLASTIC, LCC-68
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	CONEXANT	CONEXANT	CONEXANT	CONEXANT	CONEXANT	CONEXANT
Parts packaging code	LCC	QFP	QFP	QFP	LCC	LCC
package instruction	QCCJ, LDCC68,1.0SQ	QFP, QFP80,.7X.9,32	QFP, QFP80,.7X.9,32	QFP, QFP160,1.2SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ
Contacts	68	80	80	160	68	68
Reach Compliance Code	unknown	unknown	unknown	compliant	unknown	unknow
data rate	1168 Mbps	1168 Mbps	1168 Mbps	1168 Mbps	1168 Mbps	1168 Mbps
JESD-30 code	S-PQCC-J68	R-PQFP-G80	R-PQFP-G80	R-PQFP-G160	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of functions	1	3	1	3	1	3
Number of terminals	68	80	80	160	68	68
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QFP	QFP	QFP	QCCJ	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ	QFP80,.7X.9,32	QFP80,.7X.9,32	QFP160,1.2SQ	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER	FLATPACK	FLATPACK	FLATPACK	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER	FRAMER	FRAMER	FRAMER
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	GULL WING	GULL WING	GULL WING	J BEND	J BEND
Terminal pitch	1.27 mm	0.8 mm	0.8 mm	0.65 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
length	24.23 mm	20 mm	20 mm	28 mm	-	24.23 mm
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
Maximum seat height	5.08 mm	3.4 mm	3.4 mm	4.07 mm	-	5.08 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
width	24.23 mm	14 mm	14 mm	28 mm	-	24.23 mm

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