BGA Adapters
Table of Models
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
Description:
Standard Adapter (A)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Standard Socket (S)
Insulator Size:
BGA device body
+.079/(2.00mm)
Description:
Extraction Slot Adapter (AX)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Extraction Socket (SB)
Insulator Size:
BGA device body
+.157/(4.00mm)
Features:
• Soldering BGA Device to adapter
subjects BGA to less thermal
stress than soldering BGA directly
to a PCB due to the adapter’s
lower mass.
• Uses same footprint as BGA
device.
• Custom adapters available for
heat sink attachment.
• Gold plated screw-machined
terminals for superior durability.
• Unique SMT Adapter provides
reliable solution for mounting or
socketing LGA or re-worked BGA
devices.
• SMT Adapters mate with our BGA
Sockets for LGA to BGA
conversion or SMT Board to
Board applications.
Note: For use with LGA or reworked BGA devices, select surface mount (SMT) terminals which
feature solder balls on device side. SMT Adapter terminals may also be used for surface mount
board to board applications.
Options
Extraction Tool
P/N 8125
• Insert “T” bar end of tool into extraction slot adapter.
• Slide tool to end of slot and pry adapter from socket.
• Repeat in additional slots until adapter is separated from socket.
• Works with LCP or FR-4 sockets.
Extraction
Tool
Adapter
Extraction
Slot
BGA Device
Socket
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
How To Order
1
Footprint Dash #
If Applicable*
F
H A XXX - 715 G
Terminal Plating
RoHS Compliant:
Body Type
RoHS Compliant Insulators:
G - Gold
Terminal Type
See options - available with Standard,
male to male, or surface mount
terminal styles.
F - FR-4
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
J = .0315/(0.80mm)
Number of Positions
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter
(1.27 and 1.00mm only)
*See footprints section or
online database.
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
Consult factory for custom 0.75mm pitch designs.
For SMT Adapters, select Model Type A or AX
and appropriate SMT Terminal Type from page 7.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
Standard Terminals
Type -638
1.27mm pitch
BGA Adapters
Type -700
0.80mm pitch
Additional standard and custom terminals available.
See Terminals section or consult factory.
Type -715
1.00mm pitch
Standard
.062
(1.57)
.182
(4.62)
.159
(4.04)
.146
(3.71)
.009
(0.23)Dia.
.018
(0.46) Dia.
.010/(0.25)
Dia.
Type -721
1.27mm pitch
Type -735
1.00mm pitch
Type -732
0.80mm pitch
Male to Male
.062
(1.57)
.342
(8.69)
.218
(5.54)
.230
(5.84)
Footprints:
360 Pins
Footprint Number 360-2
.906 Sq.
(23.00)
2X
.018/(0.44)
Dia.
2X
.011/(0.28)
Dia.
2X
.009/(0.23)
Dia.
Tin/Lead: Type -720
Lead-free: Type -823
Tin/Lead: Type -737
Lead-free: Type -824
1.00mm pitch
.024/(0.61) Dia.
Solder Ball
Tin/Lead: Type -736
Lead-free: Type -829
0.80mm pitch
.020/(0.51) Dia.
Solder Ball
SMT (Surface Mount)
1.27mm pitch
.030/(0.76) Dia.
Solder Ball
.062
(1.57)
.182
(4.62)
.010/(0.25)
Dia.
.159
(4.04)
.146
(3.71)
.039/(1.00) Typ.
.018/(0.46)
Dia.
.009/(0.23)
Dia.
22 x 22 rows
• Footprint specific insulators
drilled to exact device pattern.
How It Works
See page 15 for Generic Reflow Profiles.
• Either Tin/Lead or Lead-free
device packages can be
attached to our RoHS
Compliant Adapters.
• PC boards can be processed
with Tin/Lead BGA sockets in
standard profiles or lead-free
BGA sockets in RoHS
Compliant, high temperature
profiles.
• Over 1000 footprints available -
see page 88, search online or
submit your device specs.
• Use our Build-A-Part feature or
search in our online BGA Socket
Finder
TM
at www.bgasockets.com.
Reflow (solder) BGA
Device to Adapter
Available Online:
• RoHS Qualification Test Report
• Technical articles
• Test data
• Signal Integrity Performance
• CAD Drawings
• BGA Footprints
Reflow (solder)
Socket to PCB
(See pgs. 8-9
for sockets)
Dimensional Information
BGA Body + .079/(2.0)
.039/(1.0)
BGA Device
Standard Adapter (A)
• Mates with Standard Socket (S)
• Adapter size equals BGA Device body + .079/(2.00)
BGA Body + .157/(4.0)
.079/(2.0)
BGA Device
Extraction Slot Adapter (AX)
• Slots allow AIC extraction tool (sold separately) to easily
remove device/adapter assembly from socket
• Mates with Extraction Socket (SB)
• Adapter size equals BGA Device body + .157/(4.00)
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
BGA Adapter
Sockets
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7
Table of Models
Insulator Size:
Description:
Standard Socket (S)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)* Same size as
BGA device body
Index: -60°C to 260°C (-76°F to 500°F)
Insulator Size:
Description:
Extraction Socket (SB)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)* 1.27mm Pitch:
BGA device body
Index: -60°C to 260°C (-76°F to 500°F)
+.079/(2.00)
1.00mm Pitch:
BGA device body
+.138/(3.50)
Features:
• Advanced
®
exclusive solder ball
terminals offer superior SMT
processing.
• Same footprint as BGA device.
• Proven long-term performance in
vigorous temperature cycling
applications - solder ball terminal
absorbs TCE mismatch.
• Closed bottom socket terminal for
100% anti-wicking of solder.
• Gold contacts allow gold/gold
interconnections to Adapter pins.
• Low insertion force socket with
multi-fingered high reliability
Beryllium Copper contacts.
• Coplanarity consistently under
.006 inch industry standard.
• Custom designs available.
RGS/RGSB replaces MGS/MGSB, MHS/MHSB replaces FHS/FHSB.
* Some sizes may only be available in FR-4. See How To Order section or consult factory.
Options
Tape and Reel Packaging
• Conforms to EIA-481 Standard.
• Pick-up tape included.
• Add -TR to end of part number when ordering.
• Custom packaging available
• If -TR is not specified, standard tray packs are
used.
• Extraction tool (P/N 8125) is available separately.
• Works with Extraction Slot Adapters and LCP or
FR-4 sockets.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
How To Order
1
Footprint Dash #
If Applicable*
M
H S XXX - 788 G G
Contact Plating
RoHS Compliant:
Body Type
G - Gold
RoHS Compliant Insulators:
Terminal Plating
F - FR-4 (0.80mm pitch)
RoHS Compliant:
M - Molded LCP (1.00mm pitch)*
G - Gold
R - Molded LCP (1.27mm pitch)
Terminal Type
*
some sizes may be available in FR-4 only
See options
Pitch
G = .050/(1.27mm)
Number of Positions
H = .039/(1.00mm)
*See footprints section or online database.
Model Type
J = .0315/(0.80mm)
S = Standard Socket
SB = Extraction Socket (1.27 and 1.00mm only)
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7
Standard Terminals
Tin/Lead: Type -636
Lead-free: Type -819
1.27mm pitch
Additional standard and custom terminals available.
See Terminals section or consult factory.
Tin/Lead: Type -790
Lead-free: Type -788
1.00mm pitch
BGA Adapter
Sockets
Tin/Lead: Type -702
Lead-free: Type -828
0.80mm pitch
SMT (Surface Mount)
.117
(2.97)
.095
(2.41)
.105
(2.67)
.088
(2.24)
.125
(3.18)
.030 Dia.
(0.76)
PATENTED
.024 Dia.
(0.61)
PATENTED
PATENTED
.020 Dia.
(0.51)
Type -673
1.27mm pitch
Type -789
1.00mm pitch
Type -731
0.80mm pitch
Thru-Hole
.117
(2.97)
.095
(2.41)
.105
(2.67)
.088
(2.24)
.125
(3.18)
Footprints:
.080
(2.03)
.128
(3.25)
.018 Dia.
(0.46)
.125
(3.18)
.011 Dia.
(0.28)
.011 Dia.
(0.28)
360 Pins
Footprint Number 360-2
.906 Sq.
(23.00)
How It Works
See page 15 for Generic Reflow Profiles.
• Either Tin/Lead or Lead-free
device packages can be
attached to our RoHS
Compliant Adapters.
• PC boards can be processed
with Tin/Lead BGA sockets in
standard profiles or lead-free
BGA sockets in RoHS
Compliant, high temperature
profiles.
.039/(1.00) Typ.
Reflow (solder) BGA
Device to Adapter
(See pgs. 6-7)
22 x 22 rows
• Full grid molded insulators
populated to exact device pattern.
• Over 1000 footprints available -
see page 88, search online or
submit your device specs.
• Use our Build-A-Part feature or
search in our online BGA Socket
Finder
TM
at www.bgasockets.com.
Reflow (solder)
Socket to PCB
Available Online:
Dimensional Information
Same Size as BGA Body
BGA Socket
PC Board
• RoHS Qualification Test Report
Standard Socket (S)
• Mates with Standard Adapter (A)
• Socket size same as BGA device body
• Use with SMT Adapter for LGA and reworked BGA device
socketing (or board to board applications)
• Technical articles
• Test data
• Signal Integrity Performance
• CAD drawings
• Generic Tin/Lead and Lead-free
Reflow Profiles
BGA Body + .079/(2.00)
or + .138/(3.50)
BGA Socket
PC Board
Extraction Socket (SB)
• Mates with Extraction Slot Adapter (AX)
• Socket size equals BGA body + .079/(2.00) for 1.27mm pitch
or BGA body + .138/(3.50) for 1.00mm pitch
• Protects valuable PCB during device/adapter extraction - tool
never touches PCB
• Available in 1.00 and 1.27mm pitch only
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
FPGA/CPLD
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