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PUSB3TB6_15

Description
ESD protection for ultra high-speed interfaces
File Size1008KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet View All

PUSB3TB6_15 Overview

ESD protection for ultra high-speed interfaces

PUSB3TB6
N7
ESD protection for ultra high-speed interfaces
Rev. 1 — 19 August 2014
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed and
Hi - Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces
against ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures for ultra high-speed
signal lines and is encapsulated in a DFN2111-7 (SOT1358-1) leadless ultra small
Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode structure offering ultra low line
capacitance of only 0.27 pF. These diodes utilize a unique snap-back structure in order to
provide protection to downstream components from ESD voltages up to
10
kV contact
exceeding IEC 61000-4-2, level 4.
XS
O
1.2 Features and benefits
System ESD protection for USB 2.0 and USB 3.0 combination, SD card 3.0 and
Thunderbolt interfaces
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of
10
kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Signal lines with
0.05 pF matching capacitance between signal pairs
Line capacitance of only 0.27 pF for each channel
Design-friendly pass-through signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
Portable and wearable devices
Smartphones and tablet PCs
TVs and monitors
DVD recorders and players
Notebooks, main board graphic cards and ports
Set-top boxes and game consoles
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