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PCIMX515DJM8C

Description
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
Categorysemiconductor    The embedded processor and controller   
File Size1MB,202 Pages
ManufacturerFREESCALE (NXP)
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PCIMX515DJM8C Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529

PCIMX515DJM8C Parametric

Parameter NameAttribute value
Number of terminals529
Minimum operating temperature-20 Cel
Maximum operating temperature85 Cel
Processing package description19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529
each_compliYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateActive
microprocessor_microcontroller_peripheral_ic_typeMICROPROCESSOR CIRCUIT
jesd_30_codeS-PBGA-B529
jesd_609_codee1
moisture_sensitivity_level3
Packaging MaterialsPLASTIC/EPOXY
ckage_codeLFBGA
ckage_equivalence_codeBGA529,23X23,32
packaging shapeSQUARE
Package SizeGRID ARRAY, LOW PROFILE, FINE PITCH
eak_reflow_temperature__cel_260
wer_supplies1.2
qualification_statusCOMMERCIAL
seated_height_max1.6 mm
sub_categoryGraphics Processors
Rated supply voltage1 V
Minimum supply voltage0.9500 V
Maximum supply voltage1.1 V
surface mountYES
CraftsmanshipCMOS
Temperature levelOTHER
terminal coatingTIN SILVER COPPER
Terminal formBALL
Terminal spacing0.8000 mm
Terminal locationBOTTOM
ime_peak_reflow_temperature_max__s_40
length19 mm
width19 mm
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX51CEC
Rev. 6,
10/2012
IMX51
i.MX51 Applications
Processors for Consumer and
Industrial Products
Package Information
Plastic Package
Case 2058 13 x 13 mm, 0.5 mm pitch
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See
Table 1
on
page 3
for ordering information.
1
Introduction
The i.MX51 multimedia applications processors
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products that
offer high performance processing and are optimized for
lowest power consumption.
The i.MX51 processors feature Freescale’s advanced and
power-efficient implementation of the ARM
Cortex™-A8 core, which operates at speeds as high as
800 MHz. Up to 200 MHz DDR2 and mobile DDR
DRAM clock rates are supported. These devices are
suitable for applications such as the following:
• Netbooks (web tablets)
• Nettops (Internet desktop devices)
• Mobile Internet devices (MID)
• Portable media players (PMP)
• Portable navigation devices (PND)
• High-end PDAs
• Gaming consoles
• Automotive navigation and entertainment (see
automotive data sheet, IMX51AEC)
© 2012 Freescale Semiconductor, Inc. All rights reserved.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 12
3. IOMUX Configuration for Boot Media . . . . . . . . . . . . . . . 14
3.1. NAND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2. SD/MMC IOMUX Pin Configuration . . . . . . . . . . . 15
3.3. I
2
C IOMUX Pin Configuration . . . . . . . . . . . . . . . . 15
3.4. eCSPI/CSPI IOMUX Pin Configuration . . . . . . . . 16
3.5. Wireless External Interface Module (WEIM) . . . . 16
3.6. UART IOMUX Pin Configuration . . . . . . . . . . . . . 16
3.7. USB-OTG IOMUX Pin Configuration . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4. Output Buffer Impedance Characteristics . . . . . . 31
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 35
4.6. Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.7. External Peripheral Interfaces . . . . . . . . . . . . . . . 74
5. Package Information and Contact Assignments . . . . . 153
5.1. 13 x 13 mm Package Information . . . . . . . . . . . . 153
5.2. 19 x 19 mm Package Information . . . . . . . . . . . . 173
5.3. 13
×
13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 191
5.4. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 195
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
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