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IS61VF25636A-7.5B3

Description
Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165
Categorystorage    storage   
File Size630KB,32 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS61VF25636A-7.5B3 Overview

Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165

IS61VF25636A-7.5B3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Objectid2060286252
Parts packaging codeBGA
package instructionTBGA, BGA165,11X15,40
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
compound_id6572563
Maximum access time7.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)117 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals165
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.045 A
Minimum standby current2.38 V
Maximum slew rate0.175 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
IS61LF25636A IS61VF25636A IS64LF25636A
IS61LF51218A IS61VF51218A
256K x 36, 512K x 18
9 Mb SYNCHRONOUS FLOW-THROUGH
AUGUST 2009
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LF: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VF: V
dd
2.5V + 5%,
V
ddq
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-pin PBGA, and 165-
pin PBGA packages
• Lead-free available
• Automotive temperature available
DESCRIPTION
The
ISSI
IS61LF/VF25636A, IS64LF25636A and IS61LF/
VF51218A are high-speed, low-power synchronous
static RAMs designed to provide burstable, high-performance
memory for communication and networking applications.
The IS61LF/VF25636A and IS64LF25636A are organized
as 262,144 words by 36 bits. The IS61LF/VF51218A is
organized as 524,288 words by 18 bits. Fabricated with
ISSI
's advanced CMOS technology, the device integrates
a 2-bit burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
Byte write operation is performed by using byte write en-
able (BWE) input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Inter-
leave burst is achieved when this pin is tied HIGH or left
floating.
FAST ACCESS TIME
Symbol
t
kq
t
kc
Parameter
Clock Access Time
Cycle Time
Frequency
-6.5
6.5
7.5
133
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev. F
07/22/09
1
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