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KM23C32101C-10

Description
MASK ROM, 4MX8, 100ns, CMOS, PDIP36, 0.600 INCH, DIP-36
Categorystorage    storage   
File Size72KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM23C32101C-10 Overview

MASK ROM, 4MX8, 100ns, CMOS, PDIP36, 0.600 INCH, DIP-36

KM23C32101C-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIP
package instructionDIP, DIP36,.6
Contacts36
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
JESD-30 codeR-PDIP-T36
JESD-609 codee0
length45.72 mm
memory density33554432 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals36
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP36,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.05 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
KM23C32101C
32M-Bit (4Mx8) CMOS MASK ROM
FEATURES
4,194,304 x 8 bit organization
Fast access time : 100ns(Max.)
Supply voltage : single +5V
Current consumption
Operating : 50mA(Max.)
Fully static operation
All inputs and outputs TTL compatible
Three state outputs
Package
-. KM23C32101C : 36-DIP-600
CMOS MASK ROM
GENERAL DESCRIPTION
The KM23C32101C is a fully static mask programmable ROM
organized 4,194,304x8 bit. It is fabricated using silicon gate
CMOS process technology.
This device operates with a 5V single power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor, and
data memory, character generator.
The KM23C32101C is packaged in a 36-DIP.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
A
21
.
.
.
.
.
.
.
.
A
0
X
BUFFERS
AND
DECODER
MEMORY CELL
MATRIX
(4,194,304x8)
A
20
A
21
A
17
A
18
A
15
1
2
3
4
5
6
7
8
9
36 V
CC
35 N.C
34 N.C
33 OE
1
32 A
19
31 A
14
30 A
13
Y
BUFFERS
AND
DECODER
SENSE AMP.
DATA OUT
BUFFERS
. . .
A
12
A
7
A
6
A
5
DIP
29 A
8
28 A
9
27 A
11
26 A
16
25 A
10
24 OE
23 Q
7
22 Q
6
21 Q
5
20 Q
4
19 Q
3
A
4
10
A
3
11
A
2
12
A
1
13
OE
OE
1
CONTROL
LOGIC
Q
0
Q
7
A
0
14
Q
0
15
Q
1
16
Q
2
17
V
SS
18
Pin Name
A
0
- A
21
Q
0
- Q
7
OE / OE
1
V
CC
V
SS
N.C
Pin Function
Address Inputs
Data Outputs
Output Enable
Power ( +5V)
Ground
No Connection
KM23C32101C

KM23C32101C-10 Related Products

KM23C32101C-10 KM23C32101C-12 KM23C32101C KM23C32101C-15
Description MASK ROM, 4MX8, 100ns, CMOS, PDIP36, 0.600 INCH, DIP-36 MASK ROM, 4MX8, 120ns, CMOS, PDIP36, 0.600 INCH, DIP-36 OTP ROM MASK ROM, 4MX8, 150ns, CMOS, PDIP36, 0.600 INCH, DIP-36
package instruction DIP, DIP36,.6 DIP, DIP36,.6 , DIP, DIP36,.6
Reach Compliance Code unknown unknown unknown unknow
Is it Rohs certified? incompatible incompatible - incompatible
Maker SAMSUNG SAMSUNG - SAMSUNG
Parts packaging code DIP DIP - DIP
Contacts 36 36 - 36
ECCN code EAR99 EAR99 - EAR99
Maximum access time 100 ns 120 ns - 150 ns
JESD-30 code R-PDIP-T36 R-PDIP-T36 - R-PDIP-T36
JESD-609 code e0 e0 - e0
length 45.72 mm 45.72 mm - 45.72 mm
memory density 33554432 bit 33554432 bit - 33554432 bi
Memory IC Type MASK ROM MASK ROM - MASK ROM
memory width 8 8 - 8
Number of functions 1 1 - 1
Number of terminals 36 36 - 36
word count 4194304 words 4194304 words - 4194304 words
character code 4000000 4000000 - 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C - 70 °C
organize 4MX8 4MX8 - 4MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code DIP DIP - DIP
Encapsulate equivalent code DIP36,.6 DIP36,.6 - DIP36,.6
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form IN-LINE IN-LINE - IN-LINE
Parallel/Serial PARALLEL PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
power supply 5 V 5 V - 5 V
Certification status Not Qualified Not Qualified - Not Qualified
Maximum seat height 5.08 mm 5.08 mm - 5.08 mm
Maximum standby current 0.05 A 0.05 A - 0.05 A
Maximum slew rate 0.05 mA 0.05 mA - 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V
surface mount NO NO - NO
technology CMOS CMOS - CMOS
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm - 2.54 mm
Terminal location DUAL DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 15.24 mm 15.24 mm - 15.24 mm

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