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IDT72231L20LB

Description
FIFO, 2KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32
Categorystorage    storage   
File Size234KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72231L20LB Overview

FIFO, 2KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32

IDT72231L20LB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFJ
package instructionCERAMIC, LCC-32
Contacts32
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time12 ns
Maximum clock frequency (fCLK)50 MHz
period time20 ns
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density18432 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals32
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX9
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width11.43 mm
CMOS SyncFIFO™
64 x 9, 256 x 9, 512 x 9,1,024 x 9,
2,048 x 9, 4,096 x 9, 8,192 x 9
FEATURES:
IDT72421, IDT72201
IDT72211, IDT72221
IDT72231, IDT72241
IDT72251
64 x 9-bit organization (IDT72421)
256 x 9-bit organization (IDT72201)
512 x 9-bit organization (IDT72211)
1,024 x 9-bit organization (IDT72221)
2,048 x 9-bit organization (IDT72231)
4,096 x 9-bit organization (IDT72241)
8,192 x 9-bit organization (IDT72251)
10 ns read/write cycle time (excluding the IDT72251)
Read and Write Clocks can be independent
Dual-Ported zero fall-through time architecture
Empty and Full Flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags can be set
to any depth
Programmable Almost-Empty and Almost-Full flags default to
Empty+7, and Full-7, respectively
Output enable puts output data bus in high-impedance state
Advanced submicron CMOS technology
Available in the 32-pin plastic leaded chip carrier (PLCC)
All devices, except the 72251, are available in the ceramic
leadless chip carrier (LCC) and 32-pin Thin Quad Flat Pack
(TQFP)
For through-hole product please see the IDT72420/72200/72210/
72220/72230/72240 data sheet
Military product compliant to MIL-STD-883, Class B
Industrial temperature range (–40°C to +85°C) is available
°
°
(plastic packages only)
D
0
- D
8
The IDT72421/72201/72211/72221/72231/72241/72251 SyncFIFO™
are very high-speed, low-power First-In, First-Out (FIFO) memories with
clocked read and write controls. These devices have a 64, 256, 512, 1,024,
2,048, 4,096, and 8,192 x 9-bit memory array, respectively. These FIFOs are
applicable for a wide variety of data buffering needs such as graphics, local area
networks and interprocessor communication.
These FIFOs have 9-bit input and output ports. The input port is controlled
by a free-running clock (WCLK), and two write enable pins (WEN1, WEN2).
Data is written into the Synchronous FIFO on every rising clock edge when the
write enable pins are asserted. The output port is controlled by another clock
pin (RCLK) and two read enable pins (REN1,
REN2).
The Read Clock can
be tied to the Write Clock for single clock operation or the two clocks can run
asynchronous of one another for dual-clock operation. An output enable pin
(OE) is provided on the read port for three-state control of the output.
The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF).
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are
provided for improved system control. The programmable flags default to
Empty+7 and Full-7 for
PAE
and
PAF,
respectively. The programmable flag
offset loading is controlled by a simple state machine and is initiated by asserting
the load pin (LD).
These FIFOs are fabricated using IDT’s high-speed submicron CMOS
technology. Military grade product is manufactured in compliance with the latest
revision of MIL-STD-883, Class B.
DESCRIPTION:
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN1
WEN2
LD
INPUT REGISTER
OFFSET REGISTER
EF
PAE
PAF
FF
WRITE CONTROL
LOGIC
RAM ARRAY
64 x 9, 256 x 9,
512 x 9, 1,024 x 9,
2,048 x 9, 4,096 x 9,
8,192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RCLK
REN1
REN2
RS
OE
Q
0
- Q
8
2655 drw 01
OCTOBER 2000
DSC-2655/-
1
2000 Integrated Device Technology, Inc.

IDT72231L20LB Related Products

IDT72231L20LB IDT72211L10L IDT72201L10L IDT72421L10L IDT72221L10L IDT72231L10L IDT72241L20LB IDT72241L10L
Description FIFO, 2KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 512X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 256X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 64X9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 1KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 2KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 12ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 4KX9, 6.5ns, Synchronous, CMOS, CQCC32, CERAMIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ QFJ QFJ QFJ QFJ QFJ QFJ QFJ
package instruction CERAMIC, LCC-32 QCCN, QCCN, QCCN, CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code not_compliant compliant compliant compliant compliant compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 12 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 12 ns 6.5 ns
period time 20 ns 10 ns 10 ns 10 ns 10 ns 10 ns 20 ns 10 ns
JESD-30 code R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm
memory density 18432 bit 4608 bit 2304 bit 576 bit 9216 bit 18432 bit 36864 bit 36864 bit
memory width 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 2048 words 512 words 256 words 64 words 1024 words 2048 words 4096 words 4096 words
character code 2000 512 256 64 1000 2000 4000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C
organize 2KX9 512X9 256X9 64X9 1KX9 2KX9 4KX9 4KX9
Exportable YES YES YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN QCCN QCCN QCCN QCCN QCCN QCCN QCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 NOT SPECIFIED 225 225 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
width 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm
Maker IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Is it lead-free? - Contains lead Contains lead Contains lead Contains lead Contains lead - Contains lead

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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