DM87S184V datasheet, PDF - EEWORLD Datasheet

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DM87S184V: DescriptionIC 2K X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM; Categorystorage storage; File Size115KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM87S184V Overview

IC 2K X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM

DM87S184V Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	QCCJ, LDCC20,.4SQ
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	S-PQCC-J20
JESD-609 code	e0
length	8.89 mm
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	20
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX4
Output characteristics	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC20,.4SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm

DM87S184V Related Products

	DM87S184V	DM87S184AN	DM87S184AJ	DM87S184AV	DM87S184J	DM87S184N	DM77S184AJ	DM77S184J
Description	IC 2K X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	IC 2K X 4 OTPROM, 45 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM	IC 2K X 4 OTPROM, 45 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM	IC 2K X 4 OTPROM, 45 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	IC 2K X 4 OTPROM, 55 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM	IC 2K X 4 OTPROM, 55 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM	IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM	IC 2K X 4 OTPROM, 70 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	QCCJ, LDCC20,.4SQ	DIP, DIP18,.3	DIP, DIP18,.3	QCCJ, LDCC20,.4SQ	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	45 ns	45 ns	45 ns	55 ns	55 ns	60 ns	70 ns
JESD-30 code	S-PQCC-J20	R-PDIP-T18	R-GDIP-T18	S-PQCC-J20	R-GDIP-T18	R-PDIP-T18	R-GDIP-T18	R-GDIP-T18
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	20	18	18	20	18	18	18	18
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C
organize	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCJ	DIP	DIP	QCCJ	DIP	DIP	DIP	DIP
Encapsulate equivalent code	LDCC20,.4SQ	DIP18,.3	DIP18,.3	LDCC20,.4SQ	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.08 mm	5.08 mm	4.57 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum slew rate	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8.89 mm	7.62 mm	7.62 mm	8.89 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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