2N2907AVC datasheet, PDF - EEWORLD Datasheet

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2N2907AVC: DescriptionSmall Signal Bipolar Transistor, 0.6A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon,; CategoryDiscrete semiconductor The transistor; File Size44KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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2N2907AVC Overview

Small Signal Bipolar Transistor, 0.6A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon,

2N2907AVC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
package instruction	UNCASED CHIP, S-XUUC-N2
Reach Compliance Code	compli
ECCN code	EAR99
Maximum collector current (IC)	0.6 A
Collector-emitter maximum voltage	60 V
Configuration	SINGLE
Minimum DC current gain (hFE)	100
JESD-30 code	S-XUUC-N2
JESD-609 code	e0
Number of components	1
Number of terminals	2
Maximum operating temperature	200 °C
Package body material	UNSPECIFIED
Package shape	SQUARE
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Polarity/channel type	PNP
Certification status	Not Qualified
surface mount	YES
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
transistor applications	SWITCHING
Transistor component materials	SILICON
Maximum off time (toff)	300 ns
Maximum opening time (tons)	45 ns
Base Number Matches	1

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2N2907ADIE

A Microsemi Company

580 Pleasant St.

Watertown, MA 02172

Phone: 617-924-9280

Fax: 617-924-1235

DIE SPECIFICATION

SWITCHING TRANSISTOR

PNP SILICON

FEATURES:

n

ELECTRICAL PERFORMANCE I.A.W. MIL-PRF-19500/291

n

AVAILABLE IN WAFER OR CHIP FORM FOR HYBRID APPLICATIONS

n

GENERAL PURPOSE-HIGH SPEED SWITCHING APPLICATIONS

n

LOW VCE(sat): .4V @ IC = 150 mAdc

PHYSICAL DIMENSIONS

Absolute Maximum Ratings:

Symbol

Vceo

Vcbo

Vebo

Ic

Tj, Tstg

Parameter

Collector-Emitter Voltage

Collector-Base Voltage

Emitter-Base Voltage

Collector Current- Continuous

Operating Junction & Storage

Temperature Range

Limit

60

5.0

600

-65 to +200

Unit

Vdc

mAdc

°C

Packaging Options:

W: Wafer (100% probed) U: Wafer (sample probed)

D: Chip (Waffle Pack)

B: Chip (Vial)

V: Chip (Waffle Pack, 100% visually inspected) X: Other

Metallization Options:

Standard: Al Top

Dash 1:

Al Top

/ Au Backside (No Dash #)

/ TiPdAg Backside

Processing Options:

Standard: Capable of JANTXV applications (No Suffix)

Suffix C: Commercial

Suffix S: Capable of S-Level equivalent applications

ORDERING INFORMATION:

PART #: 2N2907A_ _ - _

First Suffix Letter: Packaging Option

Second Suffix Letter: Processing Option

Dash #: Metallization Option

Sertech reserves the right to make changes to any product design, specification, or other information at any time without

prior notice.

Data Sheet, Die, 2N2907A MSW Rev. - 4/14/98

MSC0948.PDF

1

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