Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (TQFN only, soldering, 10s) ..............+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Test conditions: 1. The test program runs in the internal sram 2. The floating point library rts2800_fpu32.lib and rts2800_fpu32_fast_supplement.lib are loaded 3. The CPU frequency is 150MHZ 4. The te...
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1 Introduction
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0 Introduction
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DSP and ARM Processors
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