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MAX7359EWA+

Description
Microprocessor Circuit, BICMOS, PBGA25, 2.31 X 2.31 MM, ROHS COMPLIANT, WLP-25
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size177KB,20 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance  
Download Datasheet Parametric Compare View All

MAX7359EWA+ Overview

Microprocessor Circuit, BICMOS, PBGA25, 2.31 X 2.31 MM, ROHS COMPLIANT, WLP-25

MAX7359EWA+ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMaxim
Parts packaging codeBGA
package instructionVFBGA, BGA25,5X5,16
Contacts25
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time1 week
JESD-30 codeS-PBGA-B25
length2.09 mm
Humidity sensitivity level1
Number of terminals25
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA25,5X5,16
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8/3.3 V
Certification statusNot Qualified
Maximum seat height0.69 mm
Maximum slew rate0.06 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.62 V
Nominal supply voltage2.5 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceNOT SPECIFIED
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width2.09 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
19-0850; Rev 4; 6/10
KIT
ATION
EVALU
BLE
AVAILA
2-Wire Interfaced Low-EMI
Key Switch Controller/GPO
General Description
Features
o
o
o
o
o
o
o
o
o
o
o
o
o
o
Optional Key Release Detection on All Keys
Monitor Up to 64 Keys
+1.62V to +3.6V Operation
Autosleep and Autowake to Minimize Current
Consumption
Under 1µA Sleep Current
FIFO Queues Up to 16 Debounced Key Events
Key Debounce Time User Configurable from 9ms
to 40ms
Low-EMI Design Uses Static Matrix Monitoring
Hardware Interrupt at the FIFO Level or at the End
of Definable Time Period
Up to Seven Open-Drain Logic Outputs Available
Capable of Driving LEDs
400kbps, 5.5V-Tolerant, 2-Wire Serial Interface
Selectable 2-Wire, Serial-Bus Timeout
Four I
2
C Address Choices
Small, 24-Pin TQFN Package (3.5mm x 3.5mm) , or
25-Pin WLP Package (2.31mm x 2.31mm)
MAX7359
The MAX7359 I
2
C interfaced peripheral provides micro-
processors with management of up to 64 key switches.
Key codes are generated for each press and release of
a key for easier implementation of multiple key entries.
Key inputs are monitored statically, not dynamically, to
ensure low-EMI operation. The switches can be metallic
or resistive (carbon) with up to 5kΩ of resistance.
The MAX7359 features autosleep and autowake to fur-
ther minimize the power consumption of the device.
The autosleep feature puts the device in a low-power
state (1µA typ) after a sleep timeout period. The
autowake feature configures the MAX7359 to return to
normal operating mode from sleep upon a key press.
The key controller debounces and maintains a FIFO of
key-press and release events (including autorepeat, if
enabled). An interrupt (INT) output can be configured to
alert key presses either as they occur, or at maximum rate.
Any of the column drivers (COL2/PORT2–COL7/PORT7)
or the
INT,
if not used, can function as a general-pur-
pose output (GPO).
The MAX7359 is offered in small, 24-pin TQFN (3.5mm x
3.5mm) and 25-bump WLP (2.31mm x 2.31mm) pack-
ages for cell phones, pocket PCs, and other portable
consumer electronic applications. The MAX7359 oper-
ates over the -40°C to +85°C temperature range.
Ordering Information
PART
MAX7359ETG+
MAX7359EWA+
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
24 TQFN-EP*
25 WLP
Applications
Cell Phones
PDAs
Handheld Games
Portable Consumer Electronics
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
Pin Configurations
AD0
COL0
13
12 COL1
11 COL2/PORT2
10 COL5/PORT5
SDA
SCL
GND
15
18
INT 19
17
16
14
INPUT
+1.62V TO +3.6V
V
CC
MAX7359
COL_
8
SWITCH
ARRAY,
UP TO 64
SWITCHES
V
CC
20
N.C. 21
COL7/PORT7 22
ROW0 23
ROW1 24
+
1
ROW2
2
ROW3
3
COL3/PORT3
4
COL4/PORT4
5
ROW4
EP*
6
ROW5
MAX7359
I.C.
Typical Application Circuits
TOP VIEW
9
8
7
COL6/PORT6
ROW7
ROW6
8
ROW_
SCL
SDA
INT
AD0
GND
TQFN
(3.5mm x 3.5mm)
*EP = EXPOSED PAD.
Typical Application Circuits continued at end of data sheet.
Pin Configurations continued at end of data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

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Description Microprocessor Circuit, BICMOS, PBGA25, 2.31 X 2.31 MM, ROHS COMPLIANT, WLP-25 interface - specialized 2-wire IF LO-emi key switch cntrlr interface - specialized low-emi key switch controller/gpio IC KEY SWITCH 2WIRE 24TQFN Microprocessor Circuit, BICMOS, TQFN-24 Microprocessor Circuit, BICMOS, TQFN-24
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
package instruction VFBGA, BGA25,5X5,16 VFBGA, HVQCCN, HVQCCN, HVQCCN, TQFN-24
Reach Compliance Code compliant compli compliant compliant compliant compliant
JESD-30 code S-PBGA-B25 S-XBGA-B25 S-XQCC-N24 S-XQCC-N24 S-XQCC-N24 S-XQCC-N24
length 2.09 mm 2.09 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Number of terminals 25 25 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA HVQCCN HVQCCN HVQCCN HVQCCN
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum seat height 0.69 mm 0.69 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm
Terminal location BOTTOM BOTTOM QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 2.09 mm 2.09 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Is it lead-free? Lead free Lead free Lead free Lead free Lead free -
Maker Maxim Maxim - Maxim Maxim Maxim
Factory Lead Time 1 week 1 week 6 weeks 1 week - -
Humidity sensitivity level 1 1 1 1 1 -
Terminal surface NOT SPECIFIED NOT SPECIFIED Matte Tin (Sn) NOT SPECIFIED - -
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