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UPD44165094AF5-E40-EQ2

Description
QDR SRAM, 2MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165
Categorystorage    storage   
File Size389KB,40 Pages
ManufacturerNEC Electronics
Download Datasheet Parametric View All

UPD44165094AF5-E40-EQ2 Overview

QDR SRAM, 2MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165

UPD44165094AF5-E40-EQ2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNEC Electronics
package instruction13 X 15 MM, PLASTIC, BGA-165
Reach Compliance Codecompliant
Maximum access time0.45 ns
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density18874368 bit
Memory IC TypeQDR SRAM
memory width9
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX9
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.51 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
DATA SHEET
MOS INTEGRATED CIRCUIT
μ
PD44165084A, 44165094A, 44165184A, 44165364A
18M-BIT QDR
TM
II SRAM
4-WORD BURST OPERATION
Description
The
μ
PD44165084A is a 2,097,152-word by 8-bit, the
μ
PD44165094A is a 2,097,152-word by 9-bit, the
μ
PD44165184A
is a 1,048,576-word by 18-bit and the
μ
PD44165364A is a 524,288-word by 36-bit synchronous quad data rate static RAM
fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.
The
μ
PD44165084A,
μ
PD44165094A,
μ
PD44165184A and
μ
PD44165364A integrate unique synchronous
peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (K and K#) are latched on
the positive edge of K and K#.
These products are suitable for application which require synchronous operation, high speed, low voltage, high density
and wide bit configuration.
These products are packaged in 165-pin PLASTIC BGA.
Features
1.8 ± 0.1 V power supply
165-pin PLASTIC BGA (13 x 15)
HSTL interface
PLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports with concurrent transactions
100% bus utilization DDR READ and WRITE operation
Four-tick burst for reduced address frequency
Two input clocks (K and K#) for precise DDR timing at clock rising edges only
Two output clocks (C and C#) for precise flight time
and clock skew matching-clock and data delivered together to receiving device
Internally self-timed write control
Clock-stop capability. Normal operation is restored in 1,024 cycles after clock is resumed.
User programmable impedance output
<R>
Fast clock cycle time : 3.3 ns (300 MHz) , 3.7 ns (270 MHz) , 4.0 ns (250 MHz) , 5.0 ns (200 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
<R>
Operating ambient temperature : Commercial T
A
= 0 to +70°C (-E33, -E40, -E50)
Industrial
T
A
= –40 to +85°C (-E37Y, -E40Y, -E50Y)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M17771EJ3V0DS00 (3rd edition)
Date Published February 2007 NS CP(N)
Printed in Japan
The mark <R> shows major revised points.
2006
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
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