ET2147HJ1 datasheet, PDF - EEWORLD Datasheet

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ET2147HJ1: DescriptionIC,SRAM,4KX1,MOS,DIP,18PIN,CERAMIC; Categorystorage storage; File Size356KB，5 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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ET2147HJ1 Overview

IC,SRAM,4KX1,MOS,DIP,18PIN,CERAMIC

ET2147HJ1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Reach Compliance Code	compliant
Maximum access time	35 ns
I/O type	SEPARATE
JESD-30 code	R-XDIP-T18
memory density	4096 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of terminals	18
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX1
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Minimum standby current	4.5 V
Maximum slew rate	0.18 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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ET2147HJ1 Related Products

	ET2147HJ1	ET2147HN2	ET2147HN3	ET2147HN1	ET2147HJ3
Description	IC,SRAM,4KX1,MOS,DIP,18PIN,CERAMIC	IC,SRAM,4KX1,MOS,DIP,18PIN,PLASTIC	IC,SRAM,4KX1,MOS,DIP,18PIN,PLASTIC	IC,SRAM,4KX1,MOS,DIP,18PIN,PLASTIC	IC,SRAM,4KX1,MOS,DIP,18PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	compliant	not_compliant	not_compliant	not_compliant	compli
Maximum access time	35 ns	45 ns	55 ns	35 ns	55 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-XDIP-T18	R-PDIP-T18	R-PDIP-T18	R-PDIP-T18	R-XDIP-T18
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1
Number of terminals	18	18	18	18	18
word count	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4KX1	4KX1	4KX1	4KX1	4KX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.18 mA	0.18 mA	0.18 mA	0.18 mA	0.18 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	STMicroelectronics	-	-	STMicroelectronics	STMicroelectronics
package instruction	-	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	-

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