Description
The H5TQ1G6(8)3DFR-xxx series are a 1,073,741,824-bit CMOS Double Data Rate III (DDR3) Synchro-
nous DRAM, ideally suited for the main memory applications which requires large memory density and
high bandwidth. Hynix 1Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and
falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK
(falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and
falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high band-
width.
Device Features and Ordering Information
FEATURES
• DQ Power & Power supply : VDD & VDDQ = 1.5V +/-
0.075V
•
DQ Ground supply : VSSQ = Ground
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• Programmable BL=4 supported (tCCD=2CLK) for Digi-
tal consumer Applications.
• Programmable ZQ calibration supported
• BL switch on the fly
• 8banks
• On chip DLL align DQ, DQS and DQS transition with CK
• Average Refresh Cycle (Tcase of
0
o
C~ 95
o
C)
transition
- 7.8 µs at
-40
o
C ~ 85
o
C
• DM masks write data-in at the both rising and falling
- 3.9
µs at 85
o
C ~ 95
o
C
edges of the data strobe
o
o
• All addresses and control inputs except data,
data strobes and data masks latched on the
rising edges of the clock
• Programmable CAS latency 6, 7, 8, 9, 10, 11, 12, 13
and 14 supported
• Programmable additive latency 0, CL-1, and CL-2
supported
• Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9,
10
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
• Programmable PASR(Partial Array Self-Refresh) for
Digital consumer Applications.
Commercial Temperature (
0 C ~ 85 C)
Industrial Temperature ( -40
o
C ~ 85
o
C)
• Auto Self Refresh supported
• JEDEC standard 78ball FBGA(x8), 96ball FBGA(x16)
• Driver strength selected by EMRS
• Dynamic On Die Termination supported
• Asynchronous RESET pin supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• On Die Thermal Sensor supported
• 8 bit pre-fetch
* This product in compliance with the RoHS directive.
Rev. 1.7 /Sep. 2011
3
京公网安备 11010802033920号
EEWORLD
