IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,DIP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.004 A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 57 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| CD74HCT14E | IXFQ60N60X | 5962-01-324-2475 | CD74HCT14M96 | CD74HC14M96 | CD74HC14E | CD74HC14M | CD74HCT14M | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,DIP,14PIN,PLASTIC | isc N-Channel MOSFET Transistor | IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,SOP,14PIN,PLASTIC | HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDIP14 | HC/UH SERIES, HEX 1-INPUT PDSO14, SOIC-14 | HCT SERIES, HEX 1-INPUT PDSO14, SOIC-14 |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | DIP, DIP14,.3 | - | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| Reach Compliance Code | not_compliant | - | _compli | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| JESD-30 code | R-PDIP-T14 | - | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | - | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| MaximumI(ol) | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Number of terminals | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | - | DIP | SOP | SOP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP14,.3 | - | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | SOP14,.25 | SOP14,.25 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | - | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V |
| Prop。Delay @ Nom-Sup | 57 ns | - | - | 57 ns | 41 ns | 41 ns | 41 ns | - |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | YES | - | YES | YES | YES | YES | YES | YES |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | - | - | 5 V | 5 V |
| surface mount | NO | - | NO | YES | YES | NO | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |