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MPC603PRX200L

Description
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size157KB,40 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MPC603PRX200L Overview

RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255

MPC603PRX200L Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionBGA,
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency200 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheNO
JESD-30 codeS-CBGA-B255
length21 mm
low power modeYES
Number of terminals255
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height3 mm
speed200 MHz
Maximum supply voltage2.625 V
Minimum supply voltage2.375 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width21 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
G522-0267-00
(IBM Order Number)
MPC603E7VEC/D
(Motorola Order Number)
11/96
REV 1
Advance Information
PowerPC 603e
RISC Microprocessor Family:
PID7v-603e Hardware Specifications
The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of
reduced instruction set computing (RISC) microprocessors. In this document, the term
‘603e’ is used as an abbreviation for ‘PowerPC 603e microprocessor’. The PowerPC 603e
microprocessors are available from Motorola as MPC603e and from IBM as PPC603e.
Note that the 603e is implemented in both a 2.5-volt version (PID 0007v PowerPC 603e
microprocessor, abbreviated as PID7v-603e) and a 3.3-volt version (PID 0006 PowerPC
603e microprocessor, abbreviated as PID6-603e). This document describes the pertinent
physical characteristics of the PID7v-603e. For functional characteristics of the processor,
refer to the
PowerPC 603e RISC Microprocessor User’s Manual
.
This document contains the following topics:
Topic
Page
PID7v-603e Hardware Specifications
Section 1.1, “Overview”
Section 1.2, “Features”
Section 1.3, “General Parameters”
Section 1.4, “Electrical and Thermal Characteristics”
Section 1.5, “PowerPC 603e Microprocessor Pin Assignments”
Section 1.6, “PowerPC 603e Microprocessor Pinout Listings”
Section 1.7, “PowerPC 603e Microprocessor Package Descriptions”
Section 1.8, “System Design Information”
Section 1.9, “Ordering Information”
Appendix A, “General Handling Recommendations for the C4-CQFP Package”
2
3
4
4
17
19
23
29
37
38
The PowerPC name, the PowerPC logotype, PowerPC 603, and PowerPC 603e are trademarks of International Business Machines
Corporation, used by Motorola under license from International Business Machines Corporation.
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
change or discontinue this product without notice.
©
Motorola Inc., 1996. All rights reserved
Portions hereof
©
International Business Machines Corporation, 1991–1996. All rights reserved

MPC603PRX200L Related Products

MPC603PRX200L MPC603PRX240L MPC603PRX225L
Description RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 240MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 225MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
package instruction BGA, BGA, BGA,
Reach Compliance Code unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 32 32 32
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 200 MHz 240 MHz 225 MHz
External data bus width 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache NO NO NO
JESD-30 code S-CBGA-B255 S-CBGA-B255 S-CBGA-B255
length 21 mm 21 mm 21 mm
low power mode YES YES YES
Number of terminals 255 255 255
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3 mm 3 mm 3 mm
speed 200 MHz 240 MHz 225 MHz
Maximum supply voltage 2.625 V 2.625 V 2.625 V
Minimum supply voltage 2.375 V 2.375 V 2.375 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 21 mm 21 mm 21 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker Motorola ( NXP ) - Motorola ( NXP )
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