Z8523010PSCXXXX datasheet, PDF - EEWORLD Datasheet

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Z8523010PSCXXXX: DescriptionSerial I/O Controller, 2 Channel(s), CMOS, PDIP40, PLASTIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size52KB，1 Pages; ManufacturerZilog, Inc.; Websitehttps://www.zilog.com/

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Z8523010PSCXXXX Overview

Serial I/O Controller, 2 Channel(s), CMOS, PDIP40, PLASTIC, DIP-40

Z8523010PSCXXXX Parametric

Parameter Name	Attribute value
Maker	Zilog, Inc.
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
maximum clock frequency	10 MHz
JESD-30 code	R-PDIP-T40
length	52.325 mm
Number of serial I/Os	2
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.96 mm
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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Z8523010PSCXXXX Related Products

	Z8523010PSCXXXX	Z8523016VSCXXXX	Z8018218ASC	Z8018218ASCXXXX	Z8018218FSCXXXX
Description	Serial I/O Controller, 2 Channel(s), CMOS, PDIP40, PLASTIC, DIP-40	Serial I/O Controller, 2 Channel(s), CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, VQFP-100	Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, VQFP-100	Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, QFP-100
Maker	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.	Zilog, Inc.
Parts packaging code	DIP	LCC	QFP	QFP	QFP
package instruction	DIP,	QCCJ,	LFQFP,	LFQFP,	QFP,
Contacts	40	44	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknow	unknow
maximum clock frequency	10 MHz	16 MHz	18 MHz	18 MHz	18 MHz
JESD-30 code	R-PDIP-T40	S-PQCC-J44	S-PQFP-G100	S-PQFP-G100	R-PQFP-G100
length	52.325 mm	16.5862 mm	14 mm	14 mm	20 mm
Number of terminals	40	44	100	100	100
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	LFQFP	LFQFP	QFP
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.96 mm	4.57 mm	1.6 mm	1.6 mm	3.1 mm
surface mount	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	J BEND	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	0.5 mm	0.5 mm	0.65 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	QUAD
width	15.24 mm	16.5862 mm	14 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Has ADC	-	-	NO	NO	NO
bit size	-	-	8	8	8
DAC channel	-	-	NO	NO	NO
DMA channel	-	-	NO	NO	NO
Number of I/O lines	-	-	24	24	24
PWM channel	-	-	NO	NO	NO
speed	-	-	18 MHz	18 MHz	18 MHz
Nominal supply voltage	-	-	5 V	5 V	5 V

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