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Z8523016VSCXXXX

Description
Serial I/O Controller, 2 Channel(s), CMOS, PQCC44, PLASTIC, LCC-44
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size52KB,1 Pages
ManufacturerZilog, Inc.
Websitehttps://www.zilog.com/
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Z8523016VSCXXXX Overview

Serial I/O Controller, 2 Channel(s), CMOS, PQCC44, PLASTIC, LCC-44

Z8523016VSCXXXX Parametric

Parameter NameAttribute value
MakerZilog, Inc.
Parts packaging codeLCC
package instructionQCCJ,
Contacts44
Reach Compliance Codeunknown
maximum clock frequency16 MHz
JESD-30 codeS-PQCC-J44
length16.5862 mm
Number of serial I/Os2
Number of terminals44
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height4.57 mm
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width16.5862 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1

Z8523016VSCXXXX Related Products

Z8523016VSCXXXX Z8018218ASC Z8523010PSCXXXX Z8018218ASCXXXX Z8018218FSCXXXX
Description Serial I/O Controller, 2 Channel(s), CMOS, PQCC44, PLASTIC, LCC-44 Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, VQFP-100 Serial I/O Controller, 2 Channel(s), CMOS, PDIP40, PLASTIC, DIP-40 Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, VQFP-100 Microcontroller, 8-Bit, 18MHz, CMOS, PQFP100, PLASTIC, QFP-100
Maker Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc.
Parts packaging code LCC QFP DIP QFP QFP
package instruction QCCJ, LFQFP, DIP, LFQFP, QFP,
Contacts 44 100 40 100 100
Reach Compliance Code unknown unknown unknown unknow unknow
maximum clock frequency 16 MHz 18 MHz 10 MHz 18 MHz 18 MHz
JESD-30 code S-PQCC-J44 S-PQFP-G100 R-PDIP-T40 S-PQFP-G100 R-PQFP-G100
length 16.5862 mm 14 mm 52.325 mm 14 mm 20 mm
Number of terminals 44 100 40 100 100
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ LFQFP DIP LFQFP QFP
Package shape SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH IN-LINE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 1.6 mm 4.96 mm 1.6 mm 3.1 mm
surface mount YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form J BEND GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 1.27 mm 0.5 mm 2.54 mm 0.5 mm 0.65 mm
Terminal location QUAD QUAD DUAL QUAD QUAD
width 16.5862 mm 14 mm 15.24 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL MICROCONTROLLER SERIAL IO/COMMUNICATION CONTROLLER, SERIAL MICROCONTROLLER MICROCONTROLLER
Has ADC - NO - NO NO
bit size - 8 - 8 8
DAC channel - NO - NO NO
DMA channel - NO - NO NO
Number of I/O lines - 24 - 24 24
PWM channel - NO - NO NO
speed - 18 MHz - 18 MHz 18 MHz
Nominal supply voltage - 5 V - 5 V 5 V
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