MA4P506-255 datasheet, PDF - EEWORLD Datasheet

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MA4P506-255: DescriptionSILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN; CategoryDiscrete semiconductor diode; File Size62KB，1 Pages; ManufacturerTE Connectivity; Websitehttp://www.te.com

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MA4P506-255 Overview

SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN

MA4P506-255 Parametric

Parameter Name	Attribute value
Maker	TE Connectivity
package instruction	O-CEMW-N2
Contacts	2
Manufacturer packaging code	CASE 255
Reach Compliance Code	unknown
Other features	HIGH RELIABILITY
application	SWITCHING
Configuration	SINGLE
Maximum diode capacitance	0.7 pF
Diode component materials	SILICON
Maximum diode forward resistance	0.3 Ω
Diode type	PIN DIODE
JESD-30 code	O-CEMW-N2
Minority carrier nominal lifetime	3 µs
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND
Package form	MICROWAVE
Certification status	Not Qualified
Reverse test voltage	500 V
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	NO LEAD
Terminal location	END

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MA4P202,303,504,505,506 & 604

Packaged PIN Diodes - ODS-255 Case Style

Features

•

High Power PIN Diodes

Fast Speed PIN Diodes

Voltage Ratings to 1000 Volts

Long Carrier Lifetime Designs

High Reliability for Space/Military Applications

M/A-COM Products

Rev. V3

Absolute Maximum Ratings

@ T

= +25 °C (unless otherwise specified)

Parameter

Voltage

Operating Temperature

Absolution Max.

Voltage Rating

- 65°C to +175°C

-65°C to +200°C

Pdiss =

T (max Operating)-25C

Thermal Resistance

Description and Applications

MA-COM's product line of packaged PIN diodes

represents a comprehensive combination of PIN

diode electrical characteristics and package outlines.

This union of semiconductor and packaging technol-

ogy gives considerable design flexibility to the PIN

diode circuit designer. The fast switching speed PIN

diodes utilize thin I-region silicon dioxide passivated

chips that incorporate careful control of semiconduc-

tor processing. These diodes achieve consistent

performance in control circuit applications. The

packaged CERMACHIP PIN diodes employ MA-

COM's unique hard glass passivated, hermetically

sealed PIN diode chip. The packaged CERMACHIP

PIN diodes are designed for use in high power and

high RF voltage applications. The PIN diode chips

are bonded into hermetically sealed ceramic or glass

packages that are designed for high volume, close

tolerance utilization. Packages are available which

are suitable for mounting in a variety of microwave

and RF circuit media. The packaged silicon PIN di-

ode series has high inherent reliability and is capa-

ble of meeting stringent environmental tests. These

diodes may be ordered with testing to selected reli-

ability levels.

Storage Temperature

Max Power Dissipation

1. Operation of this device above any one of these parameters

may cause permanent damage.

Dimension

INCHES

0.077

0.054

0.083

0.063

1.96

1.37

2.11

1.6

Electrical Specifications T

= +25 C

Part Number

Minimum Reverse

Voltage

R @-10μA

)

100

200

500

1000

Maximum

Junction

Capacitance (pF)

@ VR

1 MHz (pF)

0.05 @10V

0.15 @ 10V

0.20 @ 100V

0.35 @ 100V

0.70 @ 100V

0.30 @ 100V

Maximum

Series

Resistance

(

Ω

)

2.5 @ 10mA

1.5 @ 10mA

0.60 @ 100mA

0.45 @ 100mA

0.30 @ 100mA

1.00 @ 100mA

Nominal Characteristics

Carrier Lifetime T

200nsec

300nsec

1usec

2 usec

3usec

I Region

Thickness (μm)

MA4P202-255

MA4P303-255

MA4P504-255

MA4P505-255

MA4P506-255

MA4P604-255

ADVANCED:

Data Sheets contain information regarding a product MA-COM Technical Solutions is

•

North America

Tel: 800.366.2266 / Fax: 978.366.2266

considering for development. Performance is based on target specifications, simulated results, and/

•

Europe

Tel: 44.1908.574.200 / Fax: 44.1908.574.300

or prototype measurements. Commitment to develop is not guaranteed.

•

Asia/Pacific

Tel: 81.44.844.8296 / Fax: 81.44.844.8298

PRELIMINARY:

Data Sheets contain information regarding a product MA-COM Technical Solutions

Visit www.macom.com for additional data sheets and product information.

has under development. Performance is based on engineering tests. Specifications are typical.

Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-

MA-COM Technical Solutions and its affiliates reserve the right to make changes to the

ment to produce in volume is not guaranteed.

product(s) or information contained herein without notice.

MA4P506-255 Related Products

	MA4P506-255	MA4P504-255	MA4P202-255	MA4P505-255	MA4P604-255
Description	SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN	SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN	SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN	SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN	SILICON, PIN DIODE, HERMETIC SEALED, CERAMIC, CASE 255, 2 PIN
Maker	TE Connectivity	TE Connectivity	TE Connectivity	TE Connectivity	TE Connectivity
package instruction	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2
Contacts	2	2	2	2	2
Manufacturer packaging code	CASE 255	CASE 255	CASE 255	CASE 255	CASE 255
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Other features	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY
application	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING
Configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum diode capacitance	0.7 pF	0.2 pF	0.05 pF	0.35 pF	0.3 pF
Diode component materials	SILICON	SILICON	SILICON	SILICON	SILICON
Maximum diode forward resistance	0.3 Ω	0.6 Ω	2.5 Ω	0.45 Ω	1 Ω
Diode type	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE
JESD-30 code	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2	O-CEMW-N2
Minority carrier nominal lifetime	3 µs	1 µs	0.2 µs	2 µs	3 µs
Number of components	1	1	1	1	1
Number of terminals	2	2	2	2	2
Maximum operating temperature	175 °C	175 °C	175 °C	175 °C	175 °C
Minimum operating temperature	-65 °C	-65 °C	-65 °C	-65 °C	-65 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND	ROUND	ROUND	ROUND	ROUND
Package form	MICROWAVE	MICROWAVE	MICROWAVE	MICROWAVE	MICROWAVE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Reverse test voltage	500 V	500 V	100 V	500 V	1000 V
surface mount	YES	YES	YES	YES	YES
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	END	END	END	END	END
Base Number Matches	-	1	1	1	-

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